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Orders Over
$5000
NXP MPC8241LZQ200D
Microprocessors - MPU 200MHz 380MIPS
Brands: NXP Semiconductor
Mfr.Part #: MPC8241LZQ200D
Datasheet: MPC8241LZQ200D Datasheet (PDF)
Package/Case: BGA-357
RoHS Status:
Stock Condition: 2,397 pcs, New Original
Product Type: Microprocessors
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $43.966 | $43.966 |
| 200 | $17.014 | $3402.800 |
| 500 | $16.417 | $8208.500 |
| 1000 | $16.122 | $16122.000 |
In Stock: 2,397 PCS
MPC8241LZQ200D General Description
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 357-PBGA (25x25)
Features
- It is based on the PowerPC architecture.
- It has a clock speed of 200 MHz.
- It has an integrated memory controller that supports SDRAM, DDR SDRAM, and ECC SDRAM.
- It has an integrated PCI controller that supports 32-bit/33 MHz PCI interfaces.
- It has multiple UART, I2C, and SPI interfaces, as well as USB and Ethernet interfaces.
- It has a PowerQUICC II communication processor that supports various communication protocols.
Application
- Network routers and switches
- Embedded systems
- Industrial automation systems
- Automotive electronics
- Aerospace and defense systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | MPC8241LZQ200D | Rohs Code | No |
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | NXP SEMICONDUCTORS |
| Package Description | 25 X 25 MM, 2.52 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-357 | Reach Compliance Code | |
| ECCN Code | 3A991.A.2 | HTS Code | 8542.31.00.01 |
| Factory Lead Time | 4 Weeks | Samacsys Manufacturer | NXP |
| Address Bus Width | 32 | Bit Size | 32 |
| Boundary Scan | YES | External Data Bus Width | 64 |
| Format | FLOATING POINT | Integrated Cache | YES |
| JESD-30 Code | S-PBGA-B357 | Low Power Mode | YES |
| Moisture Sensitivity Level | 3 | Number of Terminals | 357 |
| Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 | Surface Mount | YES |
| Technology | CMOS | Terminal Finish | TIN LEAD |
| Terminal Form | BALL | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 40 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the MPC8241LZQ200D component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : MPC8241LVR200D
Brands :
Package : BGA-357
Description : MPU PowerQUICC II MPC82xx Processor RISC 32bit 0.25um 200MHz 3.3V 357-Pin BGA Tray
Part Number : MPC8241LZU200D
Brands :
Package :
Description :
Part Number : MPC8241LZU266D
Brands :
Package :
Description :
Part Number : MPC8241LZQ266D
Brands :
Package : PBGA357
Description : 32 Bit Power Architecture, 266MHz, Integrated Host Processor, PCI, 0 to 105C
Part Number : MPC8241LZU300D
Brands :
Package :
Description :
Part Number : MPC8241LZQ300D
Brands :
Package :
Description :
Part points
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MPC8241LZQ200D is a microprocessor chip manufactured by Freescale Semiconductor, now NXP Semiconductors. It is a highly integrated system-on-a-chip (SoC) designed for embedded computing applications. The chip features a PowerPC architecture with a clock speed of 200 MHz, on-chip memory, various peripheral interfaces, and supports multiple operating systems. It provides a cost-effective solution for applications in telecommunications, networking, industrial automation, and other embedded systems.
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Features
The MPC8241LZQ200D is a microprocessor designed by Freescale Semiconductor. It features a PowerPC architecture with a clock speed of up to 200 MHz, a 32-bit data bus, and 32 KB of on-chip L1 cache. It also includes various connectivity options such as Ethernet, USB, and PCI. -
Pinout
The MPC8241LZQ200D has 200 pins and is a microprocessor designed for embedded applications. It offers a variety of functions, including a PowerPC core, on-chip cache memory, Ethernet controller, PCI interface, UART, I2C, and more. -
Manufacturer
The MPC8241LZQ200D is manufactured by Freescale Semiconductor, now known as NXP Semiconductors. NXP Semiconductors is a global semiconductor company that provides mixed-signal and standard product solutions for various industries including automotive, industrial, consumer, and communication sectors. -
Application Field
The MPC8241LZQ200D is a microprocessor chip designed for embedded systems. It can be used in various application areas such as industrial control, networking equipment, telecommunications, and automotive electronics. Its features and capabilities make it suitable for applications that require high-performance processing and low power consumption. -
Package
The MPC8241LZQ200D chip has a BGA (Ball Grid Array) package type, a 564-pin form, and a size of approximately 1.27 cm x 1.27 cm.
Datasheet PDF
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