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NXP MCIMX6L2DVN10AB 48HRS

Customized processors for specialized applications

ISO14001 ISO9001 DUNS

Brands: NXP

Mfr.Part #: MCIMX6L2DVN10AB

Datasheet: MCIMX6L2DVN10AB Datasheet (PDF)

Package/Case: BGA

RoHS Status:

Stock Condition: 3440 pcs, New Original

Product Type: Embedded Processors & Controllers

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $58.402 $58.402
200 $22.602 $4520.400
500 $21.808 $10904.000
1000 $21.415 $21415.000

In Stock:3440 PCS

- +

Quick Quote

Please submit RFQ for MCIMX6L2DVN10AB or email to us: Email: [email protected], we will contact you within 12 hours.

MCIMX6L2DVN10AB General Description

The MCIMX6L2DVN10AB is a Freescale i.MX6L Dual Cortex-A9 processor with a maximum operating frequency of 1 GHz. It features multimedia capabilities such as 2D/3D graphics acceleration, HD video processing, and support for multiple display interfaces. The processor also has integrated security features for data protection and secure boot functionality.This processor is designed for applications in the industrial, automotive, consumer, and networking markets. It has a wide range of connectivity options including Ethernet, USB, CAN, and I2C interfaces, making it suitable for a variety of IoT and embedded systems applications.The MCIMX6L2DVN10AB is manufactured using advanced process technology and is available in a small footprint package, making it ideal for space-constrained designs. It is a cost-effective and energy-efficient solution for embedded computing applications that require high performance and multimedia capabilities

MCIMX6L2DVN10AB

Features

  • The MCIMX6L2DVN10AB is a microprocessor chip designed for industrial applications
  • It features a dual-core ARM Cortex-A9 processor running at 1GHz, integrated graphics and multimedia capabilities, DDR3 memory support, and a wide range of connectivity options including Ethernet, USB, and CAN bus
  • MCIMX6L2DVN10AB

    Application

  • The MCIMX6L2DVN10AB is commonly used in industrial control systems, automotive infotainment systems, smart home devices, and medical devices
  • It is also suitable for applications in consumer electronics, point-of-sale terminals, and robotics due to its low power consumption and high performance capabilities
  • Specifications

    Parameter Value Parameter Value
    orderingCode 935321896557 isDistributor true
    salesNum MCIMX6L2DVN10AB leadTime 26
    pack_type TRAY price_flg N
    pack_desc Tray, Bakeable, Multiple in Drypack minPackQty 160
    status Not Recommended for New Designs

    Shipping

    Shipping Type Ship Fee Lead Time
    DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
    Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
    UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
    TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
    EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
    REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

    Processing Time:Shipping fee depend on different zone and country.

    Payment

    Terms of payment Hand Fee
    Wire Transfer Wire Transfer charge US$30.00 banking fee.
    Paypal Paypal charge 4.0% service fee.
    Credit Card Credit Card charge 3.5% service fee.
    Western Union Western Union charge US.00 banking fee.
    Money Gram Money Gram charge US$0.00 banking fee.

    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

    • Product

      Step1 :Product

    • Vacuum packaging

      Step2 :Vacuum packaging

    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The MCIMX6L2DVN10AB chip is a system-on-chip (SoC) from NXP Semiconductors. It belongs to the i.MX 6 series and is specifically designed for industrial applications. It features a dual-core ARM Cortex-A9 processor running at up to 1.0 GHz, a wide range of connectivity options, and support for multimedia applications. The chip provides a cost-effective and efficient solution for various industrial computing needs.
    • Features

      The features of MCIMX6L2DVN10AB are: 1. ARM Cortex-A9 processor with up to 1 GHz speed. 2. Integrated Vivante GC880 3D graphics processing unit. 3. DDR3L/LPDDR2 memory interface. 4. Integrated power management unit. 5. High-definition multimedia interface (HDMI) support. 6. USB 2.0 OTG and USB 2.0 host ports. 7. 10/100 Ethernet port.
    • Pinout

      The MCIMX6L2DVN10AB has a pin count of 400 and is a processor module from the i.MX 6 series by NXP Semiconductors. It has a variety of functions such as processing data, running applications, and supporting various communication interfaces like Ethernet, USB, and SD card.
    • Manufacturer

      The manufacturer of the MCIMX6L2DVN10AB is NXP Semiconductors. It is a global semiconductor company known for providing high-performance mixed-signal and standard product solutions. NXP specializes in various industries, including automotive, industrial, internet of things (IoT), and mobile.
    • Application Field

      The MCIMX6L2DVN10AB is commonly used in applications such as consumer electronics, industrial automation, healthcare devices, and automotive applications. It is a high-performance processor designed for embedded systems, providing advanced features and connectivity options for various industries.
    • Package

      The MCIMX6L2DVN10AB chip has a package type of LFBGA (Low-Profile Fine-Pitch Ball Grid Array), a form of 410 bd, and a size of 14x14 mm.

    Datasheet PDF

    Preliminary Specification MCIMX6L2DVN10AB PDF Download

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    • quantity

      Minimum order quantity starts from 1pcs.

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      Lowest international shipping fee starts from $0.00

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      365 days quality guarantee for all products

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