ST STM32F303RBT6

STM32F303RBT6 General Description

The STM32F303xB/STM32F303xC family is based on the high-performance Arm®Cortex®-M4 32-bit RISC core with FPU operating at a frequency of up to 72 MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded trace macrocell (ETM). The family incorporates high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 40 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals connected to two APB buses.The devices offer up to four fast 12-bit ADCs (5 Msps), seven comparators, four operational amplifiers, up to two DAC channels, a low-power RTC, up to five general-purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two I2Cs, up to three SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.The STM32F303xB/STM32F303xC family operates in the -40 to +85 °C and -40 to +105 °C temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F303xB/STM32F303xC family offers devices in four packages ranging from 48 pins to 100 pins.The set of included peripherals changes with the device chosen.Evaluation board with STM32F303VE MCU.ST-LINK/V2 in-circuit debugger/programmer for ST.Discovery kit with STM32F303VC MCU.STM32 Nucleo-64 development board with STM32F303.STM32 Nucleo-32 development board with STM32F303.STM32 Nucleo-144 development board with STM32F30.

Features

• Core: Arm^® Cortex^®-M4 32-bit CPU with FPU (72 MHz max), single-cycle multiplication and HW division, 90 DMIPS (from CCM), DSP instruction and MPU (memory protection unit)
• Operating conditions:
  • V_DD, V_DDA voltage range: 2.0 V to 3.6 V
• Memories
  • 128 to 256 Kbytes of Flash memory
  • Up to 40 Kbytes of SRAM, with HW parity check implemented on the first 16 Kbytes.
  • Routine booster: 8 Kbytes of SRAM on instruction and data bus, with HW parity check (CCM)
• CRC calculation unit
• Reset and supply management
  • Power-on/power-down reset (POR/PDR)
  • Programmable voltage detector (PVD)
  • Low-power modes: Sleep, Stop and Standby
  • V_BAT supply for RTC and backup registers
• Clock management
  • 4 to 32 MHz crystal oscillator
  • 32 kHz oscillator for RTC with calibration
  • Internal 8 MHz RC with x 16 PLL option
  • Internal 40 kHz oscillator
• Up to 87 fast I/Os
  • All mappable on external interrupt vectors
  • Several 5 V-tolerant
• Interconnect matrix
• 12-channel DMA controller
• Four ADCs 0.20 μS (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, single ended/differential input, separate analog supply from 2 to 3.6 V
• Two 12-bit DAC channels with analog supply from 2.4 to 3.6 V
• Seven fast rail-to-rail analog comparators with analog supply from 2 to 3.6 V
• Four operational amplifiers that can be used in PGA mode, all terminals accessible with analog supply from 2.4 to 3.6 V
• Up to 24 capacitive sensing channels supporting touchkey, linear and rotary touch sensors
• Up to 13 timers
  • One 32-bit timer and two 16-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
  • Two 16-bit 6-channel advanced-control timers

Application

• Industrial automation and control systems
• Motor control applications
• Internet of Things (IoT) devices
• Consumer electronics
• Medical devices
• Home automation
• Robotics

Specifications