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NXP LPC2388FBD144
ARM7 with 512 kB flash, 98 kB SRAM, Ethernet, USB 2.0 Device/Host/OTG, CAN, and 10-bit ADC
Brands: NXP Semiconductor
Mfr.Part #: LPC2388FBD144
Datasheet: LPC2388FBD144 Datasheet (PDF)
Package/Case: LQFP144
Product Type: Embedded Processors & Controllers
RoHS Status:
Stock Condition: 2128 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Features
- SCTimer / PWM: 1
- Temperature range: -40 °C to +85 °C
- Product category: 150-LPC2100/200/300/400-
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 144 | Package Category | Quad Flat Packages |
| Released Date | Jan 26, 2022 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The LPC2388FBD144 is a high-performance microcontroller from the LPC2000 series, based on the ARM7TDMI-S core. It features 512KB of flash memory, 58KB of RAM, and numerous peripherals including UART, SPI, I2C, and USB. Operating at 72 MHz, it is commonly used in embedded systems, industrial applications, and consumer electronics.
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Equivalent
Some equivalent products of LPC2388FBD144 chip are LPC2387, LPC2388, LPC2388FBD100, LPC2388FBD208, LPC2387FBD144, LPC2387FBD100, and LPC2387FA144. These chips offer similar functionality and features, but may differ in package size or pin count. -
Features
The LPC2388FBD144 is a 32-bit ARM7 microcontroller with 512KB of flash memory, 58KB of SRAM, Ethernet MAC, USB 2.0, CAN, multiple timers/counters, PWM channels, ADC/DAC, and UART interfaces. It also features a range of communication interfaces, making it ideal for embedded applications requiring high performance. -
Pinout
The LPC2388FBD144 has 144 pins and is a Microcontroller from NXP's LPC2000 family. Its functions include a 16/32-bit ARM7TDMI-S CPU, 512 KB flash memory, 58 KB RAM, multiple serial interfaces, USB 2.0 full-speed device/host/OTG, and various analog interfaces. -
Manufacturer
The LPC2388FBD144 is manufactured by NXP Semiconductors, a Dutch-American semiconductor manufacturer specializing in a variety of products including microcontrollers, sensors, and automotive components. NXP Semiconductors is a global leader in the industry and provides solutions for a wide range of applications in sectors such as automotive, industrial, and consumer electronics. -
Application Field
The LPC2388FBD144 is commonly used in embedded systems applications such as industrial automation, robotics, and motor control due to its high performance ARM7TDMI-S core, extensive peripheral options, and versatile connectivity interfaces. It is also suitable for consumer electronics, communication systems, and medical devices. -
Package
The LPC2388FBD144 chip is a Ball Grid Array (BGA) package with a form factor of 144-BGA. The size of the chip is 14mm x 14mm with a 0.8mm pitch.
We provide high quality products, thoughtful service and after sale guarantee
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Minimum order quantity starts from 1pcs.
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