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NXP LPC2387FBD100
ARM7 with 512 kB flash, 98 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC
Brands: NXP Semiconductor
Mfr.Part #: LPC2387FBD100
Datasheet: LPC2387FBD100 Datasheet (PDF)
Package/Case: LQFP-100
Product Type: Embedded Processors & Controllers
RoHS Status:
Stock Condition: 2719 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomLPC2387FBD100 General Description
LPC2387FBD100 is a microcontroller chip from the LPC23xx family, produced by NXP Semiconductors. LPC2387FBD100 is a 32-bit ARM7TDMI-S based microcontroller, which operates at a maximum clock frequency of 72MHz.
Features
- 512KB Flash memory
- 98KB RAM
- Ethernet MAC controller
- USB 2.0 full-speed device/host/OTG controller
- 10-bit ADC with 6 channels
- PWM channels
- UART, SPI, and I2C interfaces
- CAN 2.0B controller
- RTC (Real-Time Clock)
Application
- Industrial control and automation
- Motor control systems
- Data acquisition systems
- Gaming systems
- Audio and video processing systems
- Electronic point of sale (EPOS) terminals
- Smart card readers
- Mobile robots and drones
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | LPC2387FBD100 | Pbfree Code | Yes |
| Rohs Code | Yes | Part Life Cycle Code | Active |
| Ihs Manufacturer | NXP SEMICONDUCTORS | Part Package Code | QFP |
| Package Description | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100 | Pin Count | 100 |
| Reach Compliance Code | compliant | ECCN Code | 3A991.A.2 |
| HTS Code | 8542.31.00.01 | Has ADC | YES |
| Address Bus Width | Bit Size | 32 | |
| CPU Family | ARM7 | Clock Frequency-Max | 25 MHz |
| DAC Channels | YES | DMA Channels | YES |
| External Data Bus Width | JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | Length | 14 mm |
| Moisture Sensitivity Level | 3 | Number of I/O Lines | 70 |
| Number of Terminals | 100 | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | -40 °C | PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY | Package Code | LFQFP |
| Package Equivalence Code | QFP100,.63SQ,20 | Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified | RAM (bytes) | 100352 |
| ROM (words) | 524288 | ROM Programmability | FLASH |
| Seated Height-Max | 1.6 mm | Speed | 72 MHz |
| Supply Current-Max | 100 mA | Supply Voltage-Max | 3.6 V |
| Supply Voltage-Min | 3 V | Supply Voltage-Nom | 3.3 V |
| Surface Mount | YES | Technology | CMOS |
| Temperature Grade | INDUSTRIAL | Terminal Finish | TIN |
| Terminal Form | GULL WING | Terminal Pitch | 0.5 mm |
| Terminal Position | QUAD | Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 14 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the LPC2387FBD100 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : LPC2368FBD100
Brands :
Package : LQFP-100
Description : MCU 16-bit/32-bit LPC2300 ARM7TDMI-S RISC 512KB Flash 3.3V
Part Number : LPC2388FBD144
Brands :
Package : LQFP144
Description : Single-chip 16-bit/32-bit microcontroller; 512 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC
Part Number : LPC2365FBD100
Brands :
Package : LQFP100
Description : Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC
Part Number : LPC2375FBD144
Brands :
Package :
Description :
Part points
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The LPC2387FBD100 is a 32-bit microcontroller chip from NXP Semiconductors, featuring a ARM7TDMI-S core, 512 KB flash memory, 58 KB RAM, and a range of communication interfaces. It is commonly used in industrial automation, consumer electronics, and embedded systems applications.
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Equivalent
Some equivalent products of LPC2387FBD100 chip are LPC2387FBD144, LPC2387FBD144/01, and LPC2387FHT144. These are all microcontrollers based on the ARM7 core with similar features and capabilities. -
Features
- ARM7TDMI-S core with 512 KB flash memory and 58 KB SRAM - Ethernet MAC, USB 2.0, CAN, UART, I2C, SPI interfaces - Four 32-bit timers, PWM channels, ten ADC channels - On-chip PLL for CPU/USB clock generation - 2.7V to 3.6V operating voltage range - 10-bit ADC with 400 ksps conversion rate -
Pinout
The LPC2387FBD100 has 100 pins and functions as a high-performance Arm7-based microcontroller with 512 KB of Flash memory, 98 KB of SRAM, USB 2.0, Ethernet, and a variety of communication interfaces. It also features a CAN controller, SPI, I2C, UARTs, ADC, and PWM capabilities for a wide range of industrial applications. -
Manufacturer
The LPC2387FBD100 is manufactured by NXP Semiconductors, a Dutch-American semiconductor manufacturer specializing in secure connected solutions. NXP provides a wide range of products for the automotive, industrial, and smart connected devices markets. The LPC2387FBD100 is a Microcontroller Unit (MCU) based on the ARM7TDMI-S core, commonly used in various embedded applications. -
Application Field
The LPC2387FBD100 is commonly used in industrial automation, telecommunications, and consumer electronics applications. It is suitable for designing controllers, data loggers, and communication devices due to its high processing power, versatile communication interfaces, and extensive peripheral support. -
Package
The LPC2387FBD100 chip comes in a BGA (Ball Grid Array) package with a form factor of 100 pins. Its size is 10 mm x 10 mm.
Datasheet PDF
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