ST LIS3LV02DQ
Linear Accelerometer 3-Axis ±2g/ ±6g Full Scale with SPI/I2C digital interface
Brands: STMicroelectronics, Inc
Mfr.Part #: LIS3LV02DQ
Datasheet: LIS3LV02DQ Datasheet (PDF)
Package/Case: QFPN-28
Product Type: Motion & Position Sensors
RoHS Status:
Stock Condition: 2014 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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ACCELEROMETER 3 AXIS, SMD, QFPN-28; MEMS Sensor Output: Digital; Measurement Axis: X, Y, Z; Acceleration Range: ± 2g, ± 6g; Supply Voltage Min: 2.16V; Supply Voltage Max: 3.6V; Sensor Case Style: QFN; No. of Pins: 28Pins; Sensitivity Typ: 340LSB/g, 1024LSB/g; Sensitivity Min: 974LSB/g, 323LSB/g; Sensitivity Max: 1074LSB/g, 357LSB/g; Product Range: -; Automotive Qualification Standard: -; RoHS Phthalates Compliant: To Be Advised; MSL: MSL 3 - 168 hours; SVHC: No SVHC (17-Dec-2015); IC Interface Type: I2C, SPI; Operating Temperature Max: 85°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to +85°C; Supply Current: 0.65mA; Supply Voltage Range: 2.16V to 3.6V; Termination Type: Surface Mount Device
Features
- It is a low-power, high-performance accelerometer capable of measuring acceleration in three dimensions (X, Y, and Z)
- It has a full-scale range of ±2g/±6g and can measure acceleration with a sensitivity of up to 6mg/LSB
- It has an embedded self-test capability
- It operates with a wide voltage range of 2.4V to 3.6V and is designed for low-power consumption, making it suitable for portable and battery-powered applications
- It features an I2C/SPI digital interface, making it easy to interface with a microcontroller or other digital systems.
Application
- Motion sensing and detection in consumer electronics such as smartphones, tablets, and gaming controllers
- Navigation and position sensing in automotive and aerospace applications
- Vibration and shock detection in industrial equipment and machinery
- Tilt sensing and orientation detection in robotics and drones.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
feature-packaging | Tray | feature-pin-count | 28 |
feature-supplier-package | PQFP-N | feature-standard-package-name1 | QFP |
feature-cecc-qualified | No | feature-esd-protection | Yes |
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | EAR99 |
feature-svhc | No |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the LIS3LV02DQ component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : MMA7361L
Brands : NXP Semiconductors
Package :
Description :
Part Number : KXTF9
Brands :
Package :
Description : from Kionix.
Part points
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The LIS3LV02DQ chip is a digital accelerometer that measures acceleration in three axes (X, Y, and Z) with high precision. It is commonly used in various applications, including motion sensing in consumer electronics like smartphones, gaming controllers, and virtual reality devices. The chip offers low power consumption, high resolution, and can provide accurate readings for tilt, vibration, and motion detection.
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Equivalent
Some equivalent products of the LIS3LV02DQ chip include the LIS3DSH, LIS3DH, and LIS3LV02DL chips. -
Features
The LIS3LV02DQ is a low-power, three-axis accelerometer with digital output. It has a wide measurement range, high accuracy, and excellent stability over temperature. It features four selectable measurement ranges, embedded temperature sensor, and smart power-saving capabilities. The device is compact in size and suitable for various applications including motion-sensing, orientation measurement, and vibration detection. -
Pinout
The LIS3LV02DQ is a dual-axis accelerometer with a pin count of 16. It is used for detecting changes in acceleration and tilt in two perpendicular axes. The device outputs analog voltages proportional to the sensed acceleration. -
Manufacturer
The manufacturer of the LIS3LV02DQ is STMicroelectronics. It is a multinational semiconductor company that provides a wide range of products and solutions in the fields of automotive, industrial, and internet of things (IoT) applications. -
Application Field
The LIS3LV02DQ is a three-axis accelerometer sensor that is commonly used in various application areas such as gaming consoles, robotics, motion sensing devices, and mobile devices. Its compact size, low power consumption, and high sensitivity make it suitable for applications that require precise motion detection and control. -
Package
The LIS3LV02DQ chip comes in a LGA (Land Grid Array) package type, with a 4x4 mm form factor and a size of 16 mm².
Datasheet PDF
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