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HMC1118LP3DE
RF Switch IC VSAT SPDT 13 GHz 50Ohm 16-LFCSP (3x3)
Brands: Analog Devices
Mfr.Part #: HMC1118LP3DE
Datasheet: HMC1118LP3DE Datasheet (PDF)
Package/Case: CP-16-38
Product Type: RF Switch ICs
RoHS Status:
Stock Condition: 9400 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomHMC1118LP3DE General Description
The HMC1118 is a general-purpose, broadband, nonreflective single-pole, double-throw (SPDT) switch in a LFCSP surface mount package. Covering the 9 kHz to 13.0 GHz range, the switch offers high isolation and low insertion loss. The switch features >48 dB isolation, 0.68 dB insertion loss up to 8.0 GHz, and a 7.5 μs settling time of 0.05 dB margin of final RFOUT. The switch operates using positive control voltage logic lines of +3.3 V and 0 V and requires +3.3 V and −2.5 V supplies. The HMC1118 can cover the same operating frequency range with a single positive supply voltage applied and the negative supply voltage (VSS) tied to ground and still maintaining good power handling performance. The HMC1118 is packaged in a 3 mm × 3 mm, surface mount LFCSP package.
Features
- Nonreflective 50 Ω design
- Positive control: 0 V/3.3 V
- Low insertion loss: 0.68 dB at 8.0 GHz
- High isolation: 48 dB at 8.0 GHz
- High power handling:
- 35 dBm through path
- 27 dBm terminated path
- High linearity:
- 1 dB compression (P1dB): 37 dBm typical
- Input third-order intercept (IIP3): 62 dBm typical
- ESD rating: 2kV human body model (HBM)
- 3 x 3 mm, 16-Lead LFCSP Package
- No low frequency spurious
- Settling time (0.05 dB margin of final RFOUT): 7.5 μs
Application
- Test instrumentation
- Microwave radios and very small aperture terminals (VSATs)
- Military radios, radars, and electronic counter measures (ECMs)
- Fiber optics and broadband telecommunications
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | RF Switch ICs | RoHS | Details |
| Switch Configuration | SPDT | Minimum Frequency | 9 kHz |
| Maximum Frequency | 13 GHz | Insertion Loss | 1.3 dB |
| Off Isolation - Typ | 25 dB | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| Package / Case | LFCSP-16 | Technology | Si |
| Series | HMC1118 | Brand | Analog Devices |
| High Control Voltage | 2 V to 3.6 V | Moisture Sensitive | Yes |
| Number of Switches | Dual | Off Time - Max | 2.7 us |
| On Time - Max | 2.7 us | Operating Supply Current | 20 uA |
| Product Type | RF Switch ICs | Factory Pack Quantity | 500 |
| Subcategory | Wireless & RF Integrated Circuits | Supply Voltage - Max | 3.6 V |
| Supply Voltage - Min | 3 V |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The HMC1118LP3DE is a surface-mount, GaAs MESFET amplifier chip developed by Analog Devices for use in high frequency communications systems. It operates in the frequency range of DC to 12 GHz and offers exceptional gain, linearity, and low noise figure performance. This chip is ideally suited for a wide range of applications including satellite communications, radar systems, and test and measurement equipment.
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Equivalent
The equivalent products of the HMC1118LP3DE chip are the Analog Devices ADL5330 and the Qorvo TGA4535-SM. These chips are often used in the same applications as the HMC1118LP3DE and offer similar performance specifications. -
Features
HMC1118LP3DE is a high isolation SPDT switch with integrated logic circuitry. It operates from DC to 6 GHz with a typical isolation of 35 dB and low insertion loss of 0.8 dB. It can handle input IP3 of 58 dBm and has digital control interface for easy integration into systems. -
Pinout
The pin count of HMC1118LP3DE is 16 pins. It is a GaAs MMIC passive double balanced mixer with a wide IF bandwidth of DC to 3 GHz. The device operates from 2 to 18 GHz RF frequency range and can be used for up/down conversion, modulation/demodulation, and radar applications. -
Manufacturer
Analog Devices is the manufacturer of HMC1118LP3DE, a leading semiconductor company specializing in analog and digital signal processing technology. They produce a wide range of high-performance integrated circuits for a variety of industries, including automotive, communications, consumer electronics, and industrial applications. -
Application Field
The HMC1118LP3DE is a high dynamic range RF amplifier designed for applications in RF and microwave systems, including wireless communication, radar systems, and test and measurement equipment. It can be used in a wide range of applications where low noise, high linearity, and high gain are required for signal amplification. -
Package
The HMC1118LP3DE chip comes in a leadless QFN package. It has a size of 3 x 3 mm and a form factor of 14-lead plastic encapsulated surface-mount package with an exposed pad.
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