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Renesas HD6417760BL200ADV

MCU 32-bit SH-4 RISC ROMLess 1.5V/3.3V 256-Pin BGA

ISO14001 ISO9001 DUNS

Brands: Renesas Technology Corp

Mfr.Part #: HD6417760BL200ADV

Datasheet: HD6417760BL200ADV Datasheet (PDF)

Package/Case: BGA256

Product Type: Integrated Circuits (ICs)

RoHS Status:

Stock Condition: 2711 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for HD6417760BL200ADV or email to us: Email: [email protected], we will contact you within 12 hours.

HD6417760BL200ADV General Description

HD6417760BL200ADV is a part number for a microprocessor chip from the Renesas H8S family of microcontrollers. Here's some information about its features, applications, and equivalent parts number list:

hd6417760bl200adv

Features

  • It is a 32-bit microprocessor with a RISC (Reduced Instruction Set Computing) architecture.
  • It has a clock speed of 20 MHz and operates at a voltage of 3.3V.
  • It has a built-in memory management unit (MMU) for virtual memory support.
  • It has a rich set of peripheral interfaces, including UART, SPI, I2C, timers, and GPIOs.
  • It supports interrupt-based processing for efficient event handling.
  • It has a high-performance multiply-accumulate (MAC) unit for DSP (Digital Signal Processing) applications.
  • It has on-chip debug and trace capabilities for software development and debugging.
hd6417760bl200adv

Application

  • Industrial control systems
  • Automotive electronics
  • Home appliances
  • Consumer electronics
  • Medical devices
  • Embedded systems

Specifications

Parameter Value Parameter Value
Source Content uid HD6417760BL200ADV Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer RENESAS ELECTRONICS CORP
Reach Compliance Code compliant HTS Code 8542.31.00.01
Has ADC YES Address Bus Width 26
Bit Size 32 DMA Channels YES
External Data Bus Width 32 JESD-30 Code S-PBGA-B256
Length 17 mm Number of I/O Lines 69
Number of Terminals 256 Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C PWM Channels NO
Package Body Material PLASTIC/EPOXY Package Code FBGA
Package Equivalence Code BGA256,20X20,32 Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH Qualification Status Not Qualified
Speed 200 MHz Supply Current-Max 730 mA
Supply Voltage-Max 1.6 V Supply Voltage-Min 1.4 V
Supply Voltage-Nom 1.5 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Form BALL Terminal Pitch 0.8 mm
Terminal Position BOTTOM Width 17 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the HD6417760BL200ADV component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   HD6417760RF200

Brands :  

Package :  

Description :  

Part Number :   HD6417760RV200

Brands :  

Package :  

Description :  

Part Number :   HD6417760RM200

Brands :  

Package :  

Description :  

Part Number :   HD6417760RU200

Brands :  

Package :  

Description :  

Part Number :   HD6417760RT200

Brands :  

Package :  

Description :  

Part points

  • The HD6417760BL200ADV chip is a high-performance microcontroller unit (MCU) manufactured by Renesas Electronics Corporation. It features a 32-bit RISC CPU, on-chip memory, and peripherals like timers, serial interfaces, and GPIOs. The chip is commonly used in various applications, including automotive, industrial, and consumer electronics, where high processing power and robust functionality are required.
  • Features

    The HD6417760BL200ADV is a microcontroller unit (MCU) from the HD6417700 series by Renesas. It features a 32-bit RISC processor with enhanced peripheral functions, including an internal flash memory, real-time clock, and serial communication interfaces. Its advanced capabilities make it suitable for applications such as automotive systems, industrial equipment, and consumer electronics.
  • Pinout

    The HD6417760BL200ADV is a microprocessor with 176 pins. Its functions include data processing, memory management, and device control.
  • Manufacturer

    The HD6417760BL200ADV is manufactured by Renesas Electronics Corporation. It is a Japanese semiconductor company known for developing microcontrollers, system-on-chips, and other semiconductor devices used in a wide range of applications such as automotive, industrial, and consumer electronics.
  • Application Field

    The HD6417760BL200ADV is a microcontroller designed for automotive applications, specifically for advanced driver assistance systems (ADAS), as well as industrial automation, and other high-performance applications.
  • Package

    The HD6417760BL200ADV chip is available in a BGA (Ball Grid Array) package type with a form factor of 27x27mm and a size of 784 pins.

Datasheet PDF

Preliminary Specification HD6417760BL200ADV PDF Download

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