Renesas HD6417760BL200ADV
MCU 32-bit SH-4 RISC ROMLess 1.5V/3.3V 256-Pin BGA
Brands: Renesas Technology Corp
Mfr.Part #: HD6417760BL200ADV
Datasheet: HD6417760BL200ADV Datasheet (PDF)
Package/Case: BGA256
Product Type: Integrated Circuits (ICs)
RoHS Status:
Stock Condition: 2711 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomHD6417760BL200ADV General Description
HD6417760BL200ADV is a part number for a microprocessor chip from the Renesas H8S family of microcontrollers. Here's some information about its features, applications, and equivalent parts number list:
Features
- It is a 32-bit microprocessor with a RISC (Reduced Instruction Set Computing) architecture.
- It has a clock speed of 20 MHz and operates at a voltage of 3.3V.
- It has a built-in memory management unit (MMU) for virtual memory support.
- It has a rich set of peripheral interfaces, including UART, SPI, I2C, timers, and GPIOs.
- It supports interrupt-based processing for efficient event handling.
- It has a high-performance multiply-accumulate (MAC) unit for DSP (Digital Signal Processing) applications.
- It has on-chip debug and trace capabilities for software development and debugging.
Application
- Industrial control systems
- Automotive electronics
- Home appliances
- Consumer electronics
- Medical devices
- Embedded systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Source Content uid | HD6417760BL200ADV | Rohs Code | Yes |
Part Life Cycle Code | Active | Ihs Manufacturer | RENESAS ELECTRONICS CORP |
Reach Compliance Code | compliant | HTS Code | 8542.31.00.01 |
Has ADC | YES | Address Bus Width | 26 |
Bit Size | 32 | DMA Channels | YES |
External Data Bus Width | 32 | JESD-30 Code | S-PBGA-B256 |
Length | 17 mm | Number of I/O Lines | 69 |
Number of Terminals | 256 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | PWM Channels | NO |
Package Body Material | PLASTIC/EPOXY | Package Code | FBGA |
Package Equivalence Code | BGA256,20X20,32 | Package Shape | SQUARE |
Package Style | GRID ARRAY, FINE PITCH | Qualification Status | Not Qualified |
Speed | 200 MHz | Supply Current-Max | 730 mA |
Supply Voltage-Max | 1.6 V | Supply Voltage-Min | 1.4 V |
Supply Voltage-Nom | 1.5 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Form | BALL | Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM | Width | 17 mm |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the HD6417760BL200ADV component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : HD6417760RF200
Brands :
Package :
Description :
Part Number : HD6417760RV200
Brands :
Package :
Description :
Part Number : HD6417760RM200
Brands :
Package :
Description :
Part Number : HD6417760RU200
Brands :
Package :
Description :
Part Number : HD6417760RT200
Brands :
Package :
Description :
Part points
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The HD6417760BL200ADV chip is a high-performance microcontroller unit (MCU) manufactured by Renesas Electronics Corporation. It features a 32-bit RISC CPU, on-chip memory, and peripherals like timers, serial interfaces, and GPIOs. The chip is commonly used in various applications, including automotive, industrial, and consumer electronics, where high processing power and robust functionality are required.
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Features
The HD6417760BL200ADV is a microcontroller unit (MCU) from the HD6417700 series by Renesas. It features a 32-bit RISC processor with enhanced peripheral functions, including an internal flash memory, real-time clock, and serial communication interfaces. Its advanced capabilities make it suitable for applications such as automotive systems, industrial equipment, and consumer electronics. -
Pinout
The HD6417760BL200ADV is a microprocessor with 176 pins. Its functions include data processing, memory management, and device control. -
Manufacturer
The HD6417760BL200ADV is manufactured by Renesas Electronics Corporation. It is a Japanese semiconductor company known for developing microcontrollers, system-on-chips, and other semiconductor devices used in a wide range of applications such as automotive, industrial, and consumer electronics. -
Application Field
The HD6417760BL200ADV is a microcontroller designed for automotive applications, specifically for advanced driver assistance systems (ADAS), as well as industrial automation, and other high-performance applications. -
Package
The HD6417760BL200ADV chip is available in a BGA (Ball Grid Array) package type with a form factor of 27x27mm and a size of 784 pins.
Datasheet PDF
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