NXP FS32R274KCK2MMM
32-bit Microcontroller with e200z4/e200z7 architecture, 2MB Flash, 3.3V operation, Automotive grade, 257-pin LFBGA package
Brands: NXP
Mfr.Part #: FS32R274KCK2MMM
Datasheet: FS32R274KCK2MMM Datasheet (PDF)
Package/Case: BGA257
RoHS Status:
Stock Condition: 2019 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $21.742 | $21.742 |
30 | $20.913 | $627.390 |
In Stock:2019 PCS
FS32R274KCK2MMM General Description
e200z4, e200z7 (2) S32R Microcontroller IC 32-Bit Tri-Core 180MHz, 240MHz 2MB (2M x 8) FLASH 257-LFBGA (14x14)
Features
S32R27 multicore Power Architecture, 240 MHz, ISO 26262, AEC-Q100 - S32R MCUs for Radar applicationsSpecifications
Parameter | Value | Parameter | Value |
---|---|---|---|
isSample | true | sampleItemType | ITEM_TYPE_SAMPLE |
leadTime | 26 | exclusiveItemType | ITEM_TYPE_SAMPLE |
minPackQty | 152 | isExSample | true |
orderingCode | 935350816557 | isDistributor | true |
salesNum | FS32R274KCK2MMM | pack_type | TRAY |
price_flg | Y | pack_desc | Tray, Bakeable, Multiple in Drypack |
status | Active |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The FS32R274KCK2MMM chip is a high-performance microcontroller designed with advanced features for industrial and automotive applications. It offers exceptional processing power, a wide range of connectivity options, and robust security measures. With its compact size and low power consumption, it is an ideal choice for embedded systems requiring real-time capabilities and enhanced performance.
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Features
The FS32R274KCK2MMM is a thin film transistor liquid crystal display panel (TFT-LCD) with a diagonal screen size of 32 inches. It has a resolution of 3840 x 2160 pixels, a high contrast ratio, wide viewing angles, and a long lifespan. Additionally, it supports 4K Ultra HD content rendering and provides vivid and sharp image quality. -
Pinout
The FS32R274KCK2MMM is a 32-pin, double-row socket connector, commonly used in electronic devices. It provides various functions such as electrical connection, signal transmission, and power distribution between different components within the device. -
Manufacturer
The manufacturer of the FS32R274KCK2MMM is Sony. Sony Corporation is a Japanese multinational conglomerate that specializes in electronics, gaming, entertainment, and technology. -
Application Field
The FS32R274KCK2MMM is a DC film capacitor primarily used in power electronics applications such as inverters, industrial motor drives, wind turbines, solar power systems, and electric vehicle charging systems. It is designed to handle high voltage, high current, and high-frequency conditions. -
Package
The FS32R274KCK2MMM chip is available in a ball grid array (BGA) package type, with a form factor of 32.0 mm × 32.0 mm.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products