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ON FODM2701R2

Optoisolator Transistor Output 3750Vrms 1 Channel 4-SMD

ISO14001 ISO9001 DUNS

Brands: ON Semiconductor, LLC

Mfr.Part #: FODM2701R2

Datasheet: FODM2701R2 Datasheet (PDF)

Package/Case: Mini-Flat

Product Type: Transistor, Photovoltaic Output Optoisolators

RoHS Status:

Stock Condition: 3,369 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for FODM2701R2 or email to us: Email: [email protected], we will contact you within 12 hours.

FODM2701R2 General Description

The FODM121 series, FODM124, and FODM2701 consists of a gallium arsenide infrared emitting diode driving a phototransistor in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The FODM2705 consists of two gallium arsenide infrared emitting diodes connected in inverse parallel for AC operation.

fodm2701r2

Features

  • More than 5mm Creepage/Clearance
  • Compact 4-Pin Surface Mount Package
    (2.4mm Maximum Standoff Height)
  • Current Transfer Ratio in Selected Groups
    DC Input:
    FODM121: 50–600%
    FODM121A: 100–300%
    FODM121B: 50–150%
    FODM121C: 100–200%
    FODM124: 100% MIN
    FODM2701: 50–300%
    AC Input:
    FODM2705: 50–300%
  • Safety and Regulatory Approvals:
    ♦ UL1577, 3,750 VACRMS for 1 Minute
    ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

Application

  • AC-DC Merchant Power Supply
  • Consumer Appliances
  • Industrial Motor

Specifications

Parameter Value Parameter Value
Manufacturer: ON Semiconductor Product Category: Transistor Output Optocouplers
RoHS: Y Package / Case: SMD-4
Output Type: NPN Phototransistor Number of Channels: 1 Channel
If - Forward Current: 10 mA Maximum Collector Emitter Voltage: 40 V
Maximum Collector Current: 80 mA Isolation Voltage: 3750 Vrms
Maximum Collector Emitter Saturation Voltage: 0.3 V Vf - Forward Voltage: 1.4 V
Vr - Reverse Voltage: 6 V Pd - Power Dissipation: 150 mW
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 110 C
Series: FODM2701 Packaging: Reel
Configuration: 1 Channel Height: 2 mm
Length: 3.85 mm Width: 4.4 mm
Brand: ON Semiconductor / Fairchild Current Transfer Ratio: 300 %
Product Type: Transistor Output Optocouplers Factory Pack Quantity: 2500
Subcategory: Optocouplers Unit Weight: 0.005467 oz
Tags FODM2701R2, FODM2701R, FODM2701, FODM27, FODM2, FODM, FOD Product Status Active
Number of Channels 1 Voltage - Isolation 3750Vrms
Current Transfer Ratio (Min) 50% @ 5mA Current Transfer Ratio (Max) 300% @ 5mA
Rise / Fall Time (Typ) 3µs, 3µs Input Type DC
Output Type Transistor Voltage - Output (Max) 40V
Current - Output / Channel 80mA Voltage - Forward (Vf) (Typ) 1.4V (Max)
Current - DC Forward (If) (Max) 50 mA Vce Saturation (Max) 300mV
Operating Temperature -40°C ~ 110°C Mounting Type Surface Mount
Package / Case 4-SMD, Gull Wing Supplier Device Package 4-SMD
Base Product Number FODM2701

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The FODM2701R2 chip is a high-speed isolated gate driver for power electronics applications. It provides galvanic isolation and level shifting capabilities to control high voltage systems. The chip is capable of driving IGBTs, MOSFETs, and SiC/GaN devices with fast switching times and high efficiency. Overall, it offers reliable and efficient power management solutions for various industrial and renewable energy systems.
  • Equivalent

    The equivalent products of FODM2701R2 chip include FODM121R1, FODM2702R2, and FODM2703R2.
  • Features

    FODM2701R2 is an optical sensor comprising an LED and photodiode, designed for use in various applications. Key features include high-speed digital interface, low power consumption, compact size, and high noise immunity. It offers accurate proximity and gesture sensing capabilities, making it suitable for use in smartphones, tablets, and other consumer electronic devices.
  • Pinout

    The FODM2701R2 is an optocoupler with a pin count of 6. It is used to provide isolation between high-voltage and low-voltage systems, and its main function is to transfer electrical signals with high reliability and fast response times.
  • Application Field

    The FODM2701R2 is commonly used in applications such as industrial automation, power supplies, inverters, motor control, and electric vehicle charging.
  • Package

    The FODM2701R2 chip is available in a small outline package (SOP) type, with a surface mount technology (SMT) form. The package size is compact and measures approximately 7.2mm x 7.4mm.

Datasheet PDF

Preliminary Specification FODM2701R2 PDF Download

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  • Product

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  • quantity

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