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ON FODM1009

Optoisolator Transistor Output 5000Vrms 1 Channel 4-SOP

ISO14001 ISO9001 DUNS

Brands: ON Semiconductor, LLC

Mfr.Part #: FODM1009

Datasheet: FODM1009 Datasheet (PDF)

Package/Case: LSOP

RoHS Status:

Stock Condition: 2773 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for FODM1009 or email to us: Email: [email protected], we will contact you within 12 hours.

FODM1009 General Description

The FODM100x Series, single channel, DC sensing input, optocoupler consists of one gallium arsenide (GaAs) infrared light emitting diode optically coupled to one phototransistor, in a stretched body SOP 4-pin package. The input-output isolation voltage, VISO, is rated at 5,000 VACRMS

Features

  • " ≥ 8 mm Creepage and Clearance Distance, and ≥ 0.4 mm Insulation Distance to Achieve Reliable and High Voltage Insulation
  • Safety and Regulatory Approvals
  • UL1577, 5,000 VACRMS for 1 min.
  • DIN_EN/IEC60747-5-5, 890 V_Peak Working Voltage
  • High Breakdown Collector to Emitter Voltage, BVCEO = 70 V minimum
  • Extended Industrial Temperate Range, -40 to 110°C
  • Current Transfer Ratio at IF = 5 mA, VCE = 5 V, TA = 25ºC
  • FODM1007: 80 to 160%
  • FODM1008: 130 to 260%
  • FODM1009: 200 to 400%"

Application

  • Primarily suited for DC-DC Converters
  • For ground loop isolation, signal to noise isolation
  • Communications – adapters, chargers
  • Consumer – appliances, set top boxes
  • Industrial – power supplies, motor control, programmable logic control

Specifications

Parameter Value Parameter Value
Manufacturer: onsemi Product Category: Transistor Output Optocouplers
RoHS: Details Mounting Style: SMD/SMT
Package / Case: LSOP-4 Number of Channels: 1 Channel
Isolation Voltage: 5000 Vrms Output Type: NPN Phototransistor
Current Transfer Ratio - Min: 200 % Current Transfer Ratio - Max: 400 %
If - Forward Current: 50 mA Vf - Forward Voltage: 1.4 V
Maximum Collector Emitter Voltage: 70 V Maximum Collector Current: 50 mA
Maximum Collector Emitter Saturation Voltage: 300 mV Rise Time: 5.7 us
Fall Time: 8.5 us Vr - Reverse Voltage: 6 V
Pd - Power Dissipation: 150 mW Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 110 C Series: FODM1009
Packaging: Tube Brand: onsemi / Fairchild
Configuration: 1 Channel Current Transfer Ratio: 200 %
Product Type: Transistor Output Optocouplers Factory Pack Quantity: 2000
Subcategory: Optocouplers Unit Weight: 0.004157 oz
feature-type feature-maximum-forward-current-ma 50
feature-maximum-power-dissipation-mw 100 feature-packaging Tube
feature-lens-shape-type feature-rad-hard
feature-pin-count 4 feature-supplier-package LSOP
feature-standard-package-name1 feature-cecc-qualified No
feature-esd-protection feature-military No
feature-aec-qualified No feature-aec-qualified-number
feature-auto-motive No feature-p-pap No
feature-eccn-code EAR99 feature-svhc No
feature-svhc-exceeds-threshold No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The FODM1009 chip is an electronic component used in various applications such as motor control systems and power management. it is designed to provide accurate and efficient monitoring and protection for devices. the chip offers high voltage isolation and incorporates functionality for fault detection and protection, making it a reliable choice for controlling and managing power in different systems.
  • Equivalent

    There are no direct equivalent products for the FODM1009 chip. however, there are other chips available in the same category, such as aedr-8400 series from broadcom and mlx75026 from melexis, which provide similar functionality.
  • Features

    The FODM1009 is a high-speed photodiode with a small form factor, offering a wide bandwidth of 900nm to 1700nm. it has a high responsivity, low dark current, and a small capacitance, making it suitable for high-speed optical communications and industrial applications.
  • Pinout

    The FODM1009 is an optically isolated high-speed half-pitch photodiode. it has a 2-pin configuration with pin 1 being the cathode and pin 2 being the anode. pin 1 is connected to the anode terminal and pin 2 to the cathode terminal of the photodiode.
  • Application Field

    The FODM1009 is typically used in a variety of applications, including industrial automation, robotics, medical devices, sensors, bar code readers, and other applications requiring high precision and long-lasting performance.
  • Package

    The package type of the FODM1009 chip is an smt (surface mount technology) package. its form is a square with lead spacing of 0.5mm. the package size of the chip is typically 2.5mm x 2.5mm.

Datasheet PDF

Preliminary Specification FODM1009 PDF Download

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  • Product

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  • quantity

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    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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