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FDC6306P
Mosfet Array 20V 1.9A 700mW Surface Mount SuperSOT™-6
Brands: ONSEMI
Mfr.Part #: FDC6306P
Datasheet: FDC6306P Datasheet (PDF)
Package/Case: TSOT-23-6
RoHS Status:
Stock Condition: 8706 pcs, New Original
Product Type: MOSFET
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 5 | $0.122 | $0.610 |
| 50 | $0.099 | $4.950 |
| 150 | $0.087 | $13.050 |
| 500 | $0.079 | $39.500 |
| 3000 | $0.072 | $216.000 |
| 6000 | $0.068 | $408.000 |
In Stock:8706 PCS
FDC6306P General Description
These P-Channel 2.5V specified MOSFETs are produced using an advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain low gate charge for superior switching performance. These devices have been designed to offer exceptional power dissipation in a very small footprint for applications where the bigger more expensive SO-8 and TSSOP-8 packages are impractical.
Features
- -1.9 A, -20 V
- RDS(on) = 0.170 Ω @ VGS = -4.5 V
- RDS(on) = 0.250 Ω @ VGS = -2.5 V
- Low gate charge (2.3nC typical)
- Fast switching speed
- High performance trench technology for extremely low RDS(ON)
- SuperSOT™-6 package: small footprint (72% smaller than standard SO-8); low profile (1mm thick)
Application
- This product is general usage and suitable for many different applications.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | FDC6306P | Pbfree Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
| Package Description | SUPERSOT-6 | Manufacturer Package Code | 419BL |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| Samacsys Manufacturer | onsemi | Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
| DS Breakdown Voltage-Min | 20 V | Drain Current-Max (ID) | 1.9 A |
| Drain-source On Resistance-Max | 0.17 Ω | FET Technology | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 Code | R-PDSO-G6 | JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 | Number of Elements | 2 |
| Number of Terminals | 6 | Operating Mode | ENHANCEMENT MODE |
| Operating Temperature-Max | 150 °C | Operating Temperature-Min | -55 °C |
| Package Body Material | PLASTIC/EPOXY | Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE | Peak Reflow Temperature (Cel) | 260 |
| Polarity/Channel Type | P-CHANNEL | Qualification Status | Not Qualified |
| Surface Mount | YES | Terminal Finish | MATTE TIN |
| Terminal Form | GULL WING | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 | Transistor Application | SWITCHING |
| Transistor Element Material | SILICON |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The FDC6306P is a power management chip designed for portable devices. This chip integrates a battery charger, a linear regulator, a power switch, and an adjustable voltage detector into a single package, optimizing space and efficiency in electronic designs. It is suitable for applications like smartphones, tablets, and portable audio devices.
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Equivalent
The equivalent products of the FDC6306P chip are the FDC6305N and FDC6306N. These chips are similar in functionality and performance, making them suitable replacements for the FDC6306P in various applications. -
Features
The FDC6306P is a P-channel PowerTrench MOSFET with a low on-state resistance, high current rating, and low gate charge. It is designed for high efficiency power management applications such as DC-DC converters, power supplies, and battery protection circuits. It features a compact Power33 package for space-constrained designs. -
Pinout
The FDC6306P is a 6-channel electronic fuse with an integrated IC and power MOSFETs. It has 8 pins which include VCC, IN1-IN6, VOUT, and GND. The device provides overcurrent protection and fault indication for each channel, making it suitable for use in industrial and automotive applications. -
Manufacturer
The FDC6306P is a product manufactured by ON Semiconductor. ON Semiconductor is a global supplier of power management and analog semiconductor solutions. They specialize in creating energy-efficient and environmentally friendly products for a variety of industries including automotive, communication, and industrial applications. -
Application Field
The FDC6306P is popularly used in various applications such as liquid level sensing, proximity detection, flow rate monitoring, and touch sensing in consumer electronics, automotive, industrial automation, and medical devices. It is also used in white goods, home appliances, and household equipment for detecting the presence of liquid or objects. -
Package
The FDC6306P chip is available in a PowerVQFN-8 package type. Its form is Surface Mount and the size of the chip is 2mm x 2mm.
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