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Microchip DSPIC33FJ256MC710-I/PF

MCU 16-bit dsPIC RISC 256KB Flash 3.3V 100-Pin TQFP Tray / IC MCU 16BIT 256KB FLASH 100TQFP

ISO14001 ISO9001 DUNS

Brands: Microchip Technology, Inc

Mfr.Part #: DSPIC33FJ256MC710-I/PF

Datasheet: DSPIC33FJ256MC710-I/PF Datasheet (PDF)

Package/Case: TQFP-100

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 2913 pcs, New Original

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Please submit RFQ for DSPIC33FJ256MC710-I/PF or email to us: Email: [email protected], we will contact you within 12 hours.

DSPIC33FJ256MC710-I/PF General Description

IC, 16BIT MCU-DSP, 256KB FLASH, SMD; Product Range: dsPIC33F Series; Core Frequency: 40MHz; Flash Memory Size: 256KB; No. of I/O's: 85I/O's; Embedded Interface Type: ECAN, I2C, SPI, UART; Core Supply Voltage: 2.75V; DSC Case S

dspic33fj256mc710-i-pf

Features

  • Operating Conditions
  • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
  • 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
  • Qualification and Class B Support
  • AEC-Q100 REVG (Grade 1 -40ºC to +125ºC)
  • AEC-Q100 REVG (Grade 0 -40ºC to +150ºC)
  • Class B Safety Library, IEC 6073
  • Core: 16-bit dsPIC33F CPU
  • Code-efficient (C and Assembly) architecture
  • Two 40-bit wide accumulators
  • Single-cycle (MAC/MPY) with dual data fetch
  • Single-cycle mixed-sign MUL plus hardware divide
  • Clock Management
  • Programmable PLLs and oscillator clock sources
  • Fail-Safe Clock Monitor (FSCM)
  • Independent Watchdog Timer (WDT)
  • Fast wake-up and start-up
  • Power Management
  • Low-power management modes (Sleep, Idle,Doze)
  • Integrated Power-on Reset and Brown-out Reset
  • 1.35 mA/MHz dynamic current (typical)
  • 55 μA IPD current (typical)
  • Motor Control PWM
  • Up to four PWM generators with eight outputs
  • Dead Time for rising and falling edges
  • 12.5 ns PWM resolution
  • PWM support for Motor Control: BLDC, PMSM, ACIM and SRM
  • Programmable Fault inputs
  • Flexible trigger for ADC conversions and configurations
  • Advanced Analog Features
  • Two ADC modules
  • Configurable as 10-bit, 1.1 Msps with four S&H or 12-bit,500 ksps with one S&H
  • 18 analog inputs on 64-pin devices and up to
  • 32 analog inputs on 100-pin devices
  • Flexible and independent ADC trigger sources
  • Timers/Output Compare/Input Capture
  • Up to nine 16-bit timers/counters. Can pair up to make four 32-bit timers
  • Eight Output Compare modules configurable as
  • timers/counters
  • Eight Input Capture modules
  • Communication Interfaces
  • Two UART modules (10 Mbps)
  • Support for LIN 2.0 protocols and IrDA®
  • Two 4-wire SPI modules (15 Mbps)
  • Up to two I2C™ modules (up to 1 Mbaud) with SMBus support
  • Up to two Enhanced CAN (ECAN) modules (1 Mbaud) with 2.0B support
  • Quadrature Encoder Interface (QEI) module
  • Data Converter Interface (DCI) module with I2S codec support
  • Input/Output
  • 5V-tolerant pins
  • Selectable open drain, pull-ups, and pull-downs
  • Up to 5 mA overvoltage clamp current
  • External interrupts on all I/O pins
Microchip Technology, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer Microchip Technology Product Category Embedded - Microcontrollers
Series dsPIC 33F Packaging Tray Alternate Packaging
Package-Case 100-TQFP Operating-Temperature -40°C ~ 85°C (TA)
Supplier-Device-Package 100-TQFP (14x14) Number-of-I-O 85
Speed 40 MIPs EEPROM-Size -
Core-Processor dsPIC RAM-Size 30K x 8
Program-Memory-Type FLASH Peripherals Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Connectivity CAN, I2C, IrDA, LIN, SPI, UART/USART Voltage-Supply-Vcc-Vdd 3 V ~ 3.6 V
Core-Size 16-Bit Program-Memory-Size 256KB (256K x 8)
Data-Converters A/D 24x10b/12b Oscillator-Type Internal
Tags dsPIC33FJ256MC710-I, dsPIC33FJ256MC7, dsPIC33FJ256M, dsPIC33FJ2, dsPIC33FJ, dsPIC33F, dsPIC33, dsPIC3, dsPIC, dsPI, DSP Mfr Microchip Technology
Package Tray Product Status Active
Programmabe Verified Core Processor dsPIC
Core Size 16-Bit Number of I/O 85
Program Memory Size 256KB (256K x 8) Program Memory Type FLASH
EEPROM Size - RAM Size 30K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V Data Converters A/D 24x10/12b
Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount Package / Case 100-TQFP
Supplier Device Package 100-TQFP (14x14)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The dsPIC33FJ256MC710-I/PF is a high-performance 16-bit microcontroller from Microchip Technology. It features a 16-bit data path, 40 MIPS performance, up to 256 KB of flash memory, and a variety of communication peripherals. The chip is commonly used in embedded control applications requiring high performance and digital signal processing capabilities.
  • Equivalent

    Some equivalent products of DSPIC33FJ256MC710-I/PF chip are DSPIC33FJ256MC710A-I/PF and DSPIC33FJ256MC710T-I/PF. They are also part of the dsPIC33FJ series of 16-bit microcontrollers from Microchip Technology.
  • Features

    Some features of DSPIC33FJ256MC710-I/PF include 16-bit MCU/DSP core, 16 KB RAM, 256 KB Flash memory, 16-bit ADC, and motor control peripherals. It also has integrated communication peripherals like UART, SPI, and I2C, making it suitable for advanced embedded control applications.
  • Pinout

    The DSPIC33FJ256MC710-I/PF is a 64-pin microcontroller with enhanced features for digital signal processing. It features 256 KB of flash memory, 30 KB of RAM, and multiple communication interfaces. The pins serve various functions including GPIO, PWM, ADC, SPI, I2C, UART, and more for a wide range of applications.
  • Manufacturer

    The manufacturer of the DSPIC33FJ256MC710-I/PF is Microchip Technology Inc. It is an American semiconductor company that specializes in microcontroller, mixed-signal, and analog semiconductors. It is known for providing solutions for a wide range of applications in various industries including automotive, industrial, consumer, and communication sectors.
  • Application Field

    The DSPIC33FJ256MC710-I/PF is commonly used in motor control, power management, and digital power supply applications. Its high performance and integrated peripherals make it ideal for applications requiring precise control and monitoring of power systems, such as electric vehicles, industrial automation, and renewable energy systems.
  • Package

    The DSPIC33FJ256MC710-I/PF chip is available in a 64-pin TQFP (Thin Quad Flat Package) package. The form of the chip is surface mount. The size of the package is 10mm x 10mm.

Datasheet PDF

Preliminary Specification DSPIC33FJ256MC710-I/PF PDF Download

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  • quantity

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