Orders Over
$5000Infineon CY7C1514KV18-300BZXI
SRAM - Synchronous, QDR II Memory IC 72Mbit Parallel 300 MHz 165-FBGA (13x15)
Brands: Infineon
Mfr.Part #: CY7C1514KV18-300BZXI
Datasheet: CY7C1514KV18-300BZXI Datasheet (PDF)
Package/Case: PG-BGA-165
RoHS Status:
Stock Condition: 2,678 pcs, New Original
Product Type: Memory
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $114.781 | $114.781 |
200 | $44.419 | $8883.800 |
500 | $42.857 | $21428.500 |
1360 | $42.088 | $57239.680 |
In Stock: 2,678 PCS
CY7C1514KV18-300BZXI General Description
SRAM - Synchronous, QDR II Memory IC 72Mbit Parallel 300 MHz 165-FBGA (13x15)
Specifications
Parameter | Value | Parameter | Value |
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functionalPacking | TRAY | addProductInfo | 72 Mb 1.8V 300 MHz QDR-II Ind, BGA-165 |
packageNameMarketing | FBGA-165 (51-85180) | msl | 3 |
halogenFree | undefined | customerInfo | STANDARD |
fgr | A63 | productClassification | COM |
productStatusInfo | active and preferred | hfgr | B |
packageName | PG-BGA-165 | pbFree | yes |
moistureProtPack | DRY | orderingCode | SP005645061 |
fourBlockPackageName | PG-BGA-165-804 | rohsCompliant | yes |
opn | CY7C1514KV18-300BZXI | completelyPbFree | undefined |
sapMatnrSali | SP005645061 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CY7C1514KV18-300BZXI chip is a high-performance synchronous SRAM (Static Random Access Memory) device designed by Cypress Semiconductor. It has a capacity of 18 Megabits and operates at a speed of up to 300 MHz. The chip offers high-speed access and low latency, making it suitable for demanding applications such as networking, telecommunications, and industrial automation.
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Features
The CY7C1514KV18-300BZXI is a high-density synchronous SRAM with a capacity of 72 megabits. It operates at a maximum frequency of 300 MHz and has a voltage range of 1.8V to 2.5V. It offers fast access times and low power consumption, making it suitable for use in various applications that require high performance and reliability. -
Pinout
The CY7C1514KV18-300BZXI is a 484-ball BGA package. It is a 64Mb × 36 synchronous pipelined SRAM. It operates at 300MHz and is used for high-performance applications that require large and fast memory access. -
Manufacturer
Cypress Semiconductor is the manufacturer of the CY7C1514KV18-300BZXI. It is an American semiconductor design and manufacturing company known for its specialized memory and programmable system-on-chip solutions. -
Application Field
The CY7C1514KV18-300BZXI is typically used in applications such as high-performance computing, networking equipment, and telecommunications infrastructure. It is designed to provide reliable and efficient data storage and transfer in these demanding environments. -
Package
The CY7C1514KV18-300BZXI chip comes in a BGA (Ball Grid Array) package type. The form of the chip is 1366-ball, which refers to the arrangement of solder balls on the bottom of the package. The size of the chip is not explicitly provided in the given information.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products