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Infineon CY7C1514KV18-300BZXI 48HRS

SRAM - Synchronous, QDR II Memory IC 72Mbit Parallel 300 MHz 165-FBGA (13x15)

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: CY7C1514KV18-300BZXI

Datasheet: CY7C1514KV18-300BZXI Datasheet (PDF)

Package/Case: PG-BGA-165

RoHS Status:

Stock Condition: 2,678 pcs, New Original

Product Type: Memory

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $114.781 $114.781
200 $44.419 $8883.800
500 $42.857 $21428.500
1360 $42.088 $57239.680

In Stock: 2,678 PCS

- +

Quick Quote

Please submit RFQ for CY7C1514KV18-300BZXI or email to us: Email: [email protected], we will contact you within 12 hours.

CY7C1514KV18-300BZXI General Description

SRAM - Synchronous, QDR II Memory IC 72Mbit Parallel 300 MHz 165-FBGA (13x15)

cy7c1514kv18-300bzxi

Specifications

Parameter Value Parameter Value
functionalPacking TRAY addProductInfo 72 Mb 1.8V 300 MHz QDR-II Ind, BGA-165
packageNameMarketing FBGA-165 (51-85180) msl 3
halogenFree undefined customerInfo STANDARD
fgr A63 productClassification COM
productStatusInfo active and preferred hfgr B
packageName PG-BGA-165 pbFree yes
moistureProtPack DRY orderingCode SP005645061
fourBlockPackageName PG-BGA-165-804 rohsCompliant yes
opn CY7C1514KV18-300BZXI completelyPbFree undefined
sapMatnrSali SP005645061

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The CY7C1514KV18-300BZXI chip is a high-performance synchronous SRAM (Static Random Access Memory) device designed by Cypress Semiconductor. It has a capacity of 18 Megabits and operates at a speed of up to 300 MHz. The chip offers high-speed access and low latency, making it suitable for demanding applications such as networking, telecommunications, and industrial automation.
  • Features

    The CY7C1514KV18-300BZXI is a high-density synchronous SRAM with a capacity of 72 megabits. It operates at a maximum frequency of 300 MHz and has a voltage range of 1.8V to 2.5V. It offers fast access times and low power consumption, making it suitable for use in various applications that require high performance and reliability.
  • Pinout

    The CY7C1514KV18-300BZXI is a 484-ball BGA package. It is a 64Mb × 36 synchronous pipelined SRAM. It operates at 300MHz and is used for high-performance applications that require large and fast memory access.
  • Manufacturer

    Cypress Semiconductor is the manufacturer of the CY7C1514KV18-300BZXI. It is an American semiconductor design and manufacturing company known for its specialized memory and programmable system-on-chip solutions.
  • Application Field

    The CY7C1514KV18-300BZXI is typically used in applications such as high-performance computing, networking equipment, and telecommunications infrastructure. It is designed to provide reliable and efficient data storage and transfer in these demanding environments.
  • Package

    The CY7C1514KV18-300BZXI chip comes in a BGA (Ball Grid Array) package type. The form of the chip is 1366-ball, which refers to the arrangement of solder balls on the bottom of the package. The size of the chip is not explicitly provided in the given information.

Datasheet PDF

Preliminary Specification CY7C1514KV18-300BZXI PDF Download

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  • Product

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  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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