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CS5535-UDCF
Companion Device 208-Pin BGA
Brands: ADVANCED MICRO DEVICES INC
Mfr.Part #: CS5535-UDCF
Datasheet: CS5535-UDCF Datasheet (PDF)
Package/Case: BGA
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Features
- ❐ Chopper-stabilized PGIA (Programmable Gain Instrumentation Amplifier, 1x to 64x)
- – 12 nV/√Hz @ 0.1 Hz (No 1/f noise) at 64x
- – 1200 pA Input Current with Gains>1
- ❐ Delta-sigma Analog-to-digital Converter
- – Linearity Error: 0.0007% FS
- – Noise Free Resolution: Up to 23 bits
- ❐ Two- or Four-channel Differential MUX
- ❐ Scalable Input Span via Calibration
- – ±5 mV to differential ±2.5V
- ❐ Scalable VREF Input: Up to Analog Supply
- ❐ Simple Three-wire Serial Interface
- – SPI™ and Microwire™ Compatible
- – Schmitt Trigger on Serial Clock (SCLK)
- ❐ R/W Calibration Registers Per Channel
- ❐ Selectable Word Rates: 6.25 to 3,840 Sps
- ❐ Selectable 50 or 60 Hz Rejection
- ❐ Power Supply Configurations
- – VA+ = +5 V; VA- = 0 V; VD+ = +3 V to +5 V
- – VA+ = +2.5 V; VA- = -2.5 V; VD+ = +3 V to +5 V
- – VA+ = +3 V; VA- = -3 V; VD+ = +3 V
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | Part Package Code | BGA |
| Package Description | 23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, MO-151BAJ-2, BGA-208 | Pin Count | 208 |
| Reach Compliance Code | HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | Boundary Scan | YES |
| Bus Compatibility | PCI; CARDBUS; USB; ISA; ATA | Clock Frequency-Max | 67.5 MHz |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE | Data Encoding/Decoding Method | NRZ |
| Data Transfer Rate-Max | 0.1875 MBps | External Data Bus Width | 32 |
| JESD-30 Code | S-PBGA-B208 | JESD-609 Code | e2 |
| Length | 23 mm | Low Power Mode | YES |
| Moisture Sensitivity Level | 3 | Number of Serial I/Os | 2 |
| Number of Terminals | 208 | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | Package Equivalence Code | BGA208,17X17,50 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 | Qualification Status | Not Qualified |
| Seated Height-Max | 2.34 mm | Supply Voltage-Max | 1.58 V |
| Supply Voltage-Min | 1.14 V | Supply Voltage-Nom | 1.5 V |
| Surface Mount | YES | Technology | CMOS |
| Temperature Grade | OTHER | Terminal Finish | TIN SILVER |
| Terminal Form | BALL | Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM | Width | 23 mm |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CS5535-UDCF chip is a specialized integrated circuit designed by Cirrus Logic. It serves as a system controller for embedded applications, particularly in the field of industrial and automotive electronics. The chip combines various functionalities including analog and digital signal processing, making it suitable for diverse sensor interfacing and control tasks in embedded systems.
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Equivalent
Equivalent products to the CS5535-UDCF chip include AMD Geode LX800, Intel Atom E3800 series, and VIA Eden processors. These options offer comparable features and performance suitable for embedded computing applications. -
Features
1. Low power consumption 2. Integrated interface supports IDE and USB devices 3. Dual-Mode DMA engine 4. Integrated audio and modem functions 5. Integrated RTC and UART 6. ACPI compliant power management 7. In-system Flash BIOS programming 8. Windows CE and Linux support. -
Pinout
The CS5535-UDCF is a microcontroller with 128-pin count. It serves various functions including analog-to-digital conversion, system management, and control in embedded systems, particularly in industrial and automotive applications. -
Manufacturer
The CS5535-UDCF is manufactured by Cirrus Logic, a semiconductor company specializing in analog and mixed-signal integrated circuits. They design chips for a variety of applications including audio, industrial, and energy markets. -
Application Field
The CS5535-UDCF is a specialized chip for power management in embedded systems, commonly used in portable devices like laptops, tablets, and handheld gaming consoles. It regulates power consumption efficiently, extending battery life and enhancing device performance. -
Package
The CS5535-UDCF chip is available in a 128-pin MQFP (Metric Quad Flat Package) form. The package size typically measures 20mm x 20mm, providing a compact design suitable for various embedded applications.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
