CC1110F32RHHR
RF System on a Chip - SoC Sub-1GHz SoC w/ MCU & 16kB Flash memory
Brands: TEXAS INSTRUMENTS INC
Mfr.Part #: CC1110F32RHHR
Datasheet: CC1110F32RHHR Datasheet (PDF)
Package/Case: VQFN-36
RoHS Status:
Stock Condition: 6554 pcs, New Original
Product Type: RF System on a Chip - SoC
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $2.954 | $2.954 |
10 | $2.590 | $25.900 |
30 | $2.375 | $71.250 |
100 | $1.977 | $197.700 |
500 | $1.876 | $938.000 |
1000 | $1.830 | $1830.000 |
In Stock:6554 PCS
CC1110F32RHHR General Description
Description for the CC1110-CC1111The CC1110Fx, CC1111Fx is a true low-power sub- 1 GHz system-on-chip (SoC) designed for low power wireless applications. The CC1110Fx, CC1111Fx combines the excellent performance of the state-of-the-art RF transceiver CC1101 with an industry-standard enhanced 8051 MCU, up to 32 kB of in-system programmable flash memory and up to 4 kB of RAM, and many other powerful features. The small 6x6 mm package makes it very suited for applications with size limitations.The CC1110Fx, CC1111Fx is highly suited for systems where very low power consumption is required. This is ensured by several advanced low-power operating modes. The CC1111Fx adds a full-speed USB 2.0 interface to the feature set of the CC1110Fx. Interfacing to a PC using the USB interface is quick and easy, and the high data rate (12 Mbps) of the USB interface avoids the bottlenecks of RS-232 or low-speed USB interfaces.
Features
Features for the CC1110-CC1111
- Radio
- High-performance RF transceiver based on the market-leading CC1101
- Excellent receiver selectivity and blocking performance
- High sensitivity (–110 dBm at 1.2 kBaud)
- Programmable data rate up to 500 kBaud
- Programmable output power up to 10 dBm for all supported frequencies
- Frequency range: 300 – 348 MHz, 391 – 464 MHz and 782 – 928 MHz
- Digital RSSI / LQI support
- Low Power
- Low current consumption (RX: 16.2 mA at 1.2 kBaud, TX: 15.2 mA at −6 dBm output power)
- 0.3 µA in PM3 (the operating mode with the lowest power consumption)
- 0.5 µA in PM2 (operating mode with the second lowest power consumption, timer or external interrupt wakeup)
- RoHS Compliant 6 mm × 6 mm QFN-40 Package
- MCU, Memory, and Peripherals
- High performance and low power 8051 microcontroller core.
- Powerful DMA functionality
- 8/16/32 KB in-system programmable flash, and 1, 2, 4 KB RAM
- Full-Speed USB Controller with 1 KB FIFO (CC1111Fx)
- 128-bit AES security coprocessor
- 7 – 12 bit ADC with up to eight inputs
- IS interface
- Two USARTs
- 16-bit timer with DSM mode
- Three 8-bit timers
- Hardware debug support
- 21 (CC1110Fx) or 19 (CC1111Fx) GPIO pins
- SW compatible with CC2510Fx, CC2511Fx
- General
- Wide supply voltage range (2.0V – 3.6V)
- RoHS compliant 6×6 mm QFN 36 package
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Source Content uid | CC1110F32RHHR | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | Package Description | HVQCCN, LCC36,.24SQ,20 |
Reach Compliance Code | compliant | ECCN Code | 5A992.C |
HTS Code | 8542.31.00.01 | Samacsys Manufacturer | Texas Instruments |
Has ADC | YES | Address Bus Width | |
Bit Size | 8 | Boundary Scan | NO |
CPU Family | 8051 | Clock Frequency-Max | 27 MHz |
DAC Channels | NO | DMA Channels | YES |
External Data Bus Width | Format | FIXED POINT | |
Integrated Cache | YES | JESD-30 Code | S-PQCC-N36 |
JESD-609 Code | e4 | Length | 6 mm |
Low Power Mode | YES | Moisture Sensitivity Level | 3 |
Number of DMA Channels | 5 | Number of External Interrupts | 18 |
Number of I/O Lines | 21 | Number of Terminals | 36 |
Number of Timers | 4 | On Chip Data RAM Width | 8 |
On Chip Program ROM Width | 16 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY | Package Code | HVQCCN |
Package Equivalence Code | LCC36,.24SQ,20 | Package Shape | SQUARE |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Peak Reflow Temperature (Cel) | 260 |
RAM (bytes) | 4096 | RAM (words) | 4096 |
ROM (words) | 16384 | ROM Programmability | FLASH |
Seated Height-Max | 1 mm | Speed | 27 MHz |
Supply Voltage-Max | 3.6 V | Supply Voltage-Min | 2 V |
Supply Voltage-Nom | 3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | NICKEL PALLADIUM GOLD SILVER | Terminal Form | NO LEAD |
Terminal Pitch | 0.5 mm | Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 6 mm |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The CC1110F32RHHR is a highly integrated SoC (System on Chip) designed for low power wireless applications. It features an 8051 microcontroller core, a sub-1 GHz RF transceiver, and extensive GPIO and peripherals for easy integration into various IoT devices. Its small form factor and low power consumption make it ideal for applications such as wireless sensor networks and industrial automation.
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Equivalent
Some equivalent products of the CC1110F32RHHR chip are CC1110F32, CC1110F128, CC1111F32, and CC1111F128 from Texas Instruments. These chips offer similar features and functionality, making them suitable replacements for the CC1110F32RHHR. -
Features
CC1110F32RHHR is a high-performance System-on-Chip (SoC) that operates in the 433/868/915 MHz ISM frequency bands. It features a powerful 8051 microcontroller core, RF transceiver with hardware data encryption, and low-power consumption for longer battery life in various applications such as wireless sensor networks and smart metering. -
Pinout
The CC1110F32RHHR is a 32-pin wireless microcontroller from Texas Instruments. Its functions include RF communication, low-power operation, and on-chip peripherals. The pin count includes VDD and GND pins, digital I/O, UART, SPI, ADC, and more. -
Manufacturer
Texas Instruments is the manufacturer of the CC1110F32RHHR. They are a global semiconductor company that designs and manufactures a wide range of electronics components, including microcontrollers, processors, and sensors. Their products are used in various industries such as automotive, industrial, and consumer electronics. -
Application Field
1. Wireless sensor networks 2. Industrial automation 3. Home automation 4. Internet of Things (IoT) devices 5. Smart meters 6. Remote monitoring and control systems 7. Medical devices 8. Security systems -
Package
The CC1110F32RHHR chip is in a QFN package type, with a quad flat no-leads form. It has a size of 6mm x 6mm.
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