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NXP BGA6589,135
RF Amplifier IC PCS, CDPD, Broadcast Television 0Hz ~ 3GHz SOT-89-3
Brands: NXP
Mfr.Part #: BGA6589,135
Datasheet: BGA6589,135 Datasheet (PDF)
Package/Case: SOT-89
Product Type: RF Wireless Misc
RoHS Status:
Stock Condition: 9458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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RF Amplifier IC PCS, CDPD, Broadcast Television 0Hz ~ 3GHz SOT-89-3
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | NXP | Product Category: | RF Wireless Misc |
| RoHS: | Details | Supply Voltage - Max: | 6 V |
| Operating Supply Current: | 150 mA | Operating Temperature Range: | - 40 C to + 85 C |
| Package / Case: | SOT-89 | Packaging: | MouseReel |
| Brand: | NXP Semiconductors | Maximum Operating Temperature: | + 85 C |
| Minimum Operating Temperature: | - 40 C | Mounting Style: | SMD/SMT |
| Product Type: | RF Wireless Misc | Factory Pack Quantity: | 4000 |
| Subcategory: | Wireless & RF Integrated Circuits | Technology: | Si |
| Type: | MMIC Wideband Medium Power Amplifier | Part # Aliases: | 934057503135 |
| Unit Weight: | 0.001799 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BGA6589,135 chip is a type of Ball Grid Array (BGA) integrated circuit that is commonly used in electronic devices. It is designed to provide high-performance processing capabilities and is often used in applications such as smartphones, tablets, and other portable devices. The chip offers advanced features and functionality, making it suitable for a wide range of applications in the electronics industry.
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Features
- BGA6589,135 is a ball grid array (BGA) package used for integrated circuits. - It has 6589 electrical connections for efficient data communication. - The high pin count allows for complex functions to be performed by the integrated circuit. - The package provides reliable connections and thermal dissipation for improved performance. -
Pinout
The BGA6589,135 is a ball grid array (BGA) package with 65 pins. The pin count refers to the number of electrical connections available on the package. The specific functions of each pin will depend on the integrated circuit (IC) or component that is housed within the BGA package. -
Manufacturer
The manufacturer of the BGA6589,135 is NXP Semiconductors. It is a global semiconductor company that specializes in the design, development, and production of integrated circuits and other electronic components. -
Application Field
The BGA6589,135 is a high-performance differential amplifier specifically designed for RF applications. It is commonly used in wireless communication systems, including cellular base stations, wireless infrastructure, and RF transceiver modules. It offers a high gain, low noise figure, and low distortion, making it suitable for high-frequency signal amplification in these applications. -
Package
The BGA6589,135 chip is a Ball Grid Array (BGA) package type. It has a form factor of a 6mm x 6mm square.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
