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Intel BD82HM77 SLJ8C

Chipsets HM77 Express Chipset Mobile FCBGA-989 DI DISC-BY-MFG-09/15

ISO14001 ISO9001 DUNS

Brands: Intel

Mfr.Part #: BD82HM77 SLJ8C

Datasheet: BD82HM77 SLJ8C Datasheet (PDF)

Package/Case: FCBGA-989

RoHS Status:

Stock Condition: 6554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BD82HM77 SLJ8C or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of BD82HM77 SLJ8C from Intel and we guarantee that they are original,brand new parts sourced directly from Intel We can provide quality testing reports for BD82HM77 SLJ8C upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

Intel Inventory

Specifications

Parameter Value Parameter Value
Manufacturer Intel Product Category Chipsets
RoHS Details Series HM77
Product Mobile Chipsets Type PCH
Package / Case FCBGA-989 Code Name Panther Point
Mounting Style SMD/SMT Chipset Series HM77
Embedded Options Non-Embedded Integrated Graphics Without Graphics
Brand Intel Length 25 mm
Moisture Sensitive Yes Number of Displays Supported 2
Number of SATA Ports 6 Number of USB Ports 14
Packaging ["Reel", "Cut Tape", "MouseReel"] PCIe Configurations 8 Lanes
PCIe Revision Revision 2.0 Product Type Chipsets
Factory Pack Quantity 450 Subcategory Chipsets
TDP - Max 4.1 W USB Revision Revision 2.0
Width 25 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BD82HM77 SLJ8C is a chipset designed for use in laptops and desktops. It supports Intel Core processors and includes features such as USB 3.0, SATA 6Gb/s, and PCI Express 3.0 support. This chipset offers improved performance and connectivity options for computing devices.
  • Equivalent

    The equivalent products of the BD82HM77 SLJ8C chip are Intel QM77, HM76, HM75 or HM70 chipsets. These chipsets are also designed for use in laptops and have similar features and capabilities as the BD82HM77 SLJ8C chip.
  • Features

    BD82HM77 SLJ8C is a mobile chipset for Intel 3rd generation Core processors. It features support for USB 3.0, SATA 6Gb/s, and PCIe 3.0. It also includes Intel HD Graphics with support for DirectX 11, OpenGL 4.0, and OpenCL 1.1. Additionally, it supports up to 16GB of dual-channel DDR3 memory.
  • Pinout

    The BD82HM77 SLJ8C is a Mobile Intel® HM77 Express Chipset with a 989-Ball Micro FCBGA package. It supports 3rd generation Intel® Core™ processors and has a pin count of 989. Its functions include supporting up to 3 independent displays, USB 3.0, and SATA 6 Gb/s for high-performance computing.
  • Manufacturer

    BD82HM77 SLJ8C is manufactured by Intel Corporation. Intel Corporation is a multinational technology company that designs and manufactures semiconductors and computer hardware products, including processors, motherboards, and networking equipment. Intel is one of the largest semiconductor manufacturers in the world and is known for its innovation in the computing industry.
  • Application Field

    The BD82HM77 SLJ8C chipset is commonly used in laptops and desktop computers for tasks such as office productivity, multimedia entertainment, and casual gaming. It is also utilized in industrial and embedded systems for various applications that require high performance and efficiency.
  • Package

    The BD82HM77 SLJ8C chip is a BGA package type, a 31mm x 24mm form, and has a size of 968mm².

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  • Product

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  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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