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BCM5354KFBG

RF System on a Chip - SoC 802.11g Single-chip Router

ISO14001 ISO9001 DUNS

Brands: Broadcom Limited

Mfr.Part #: BCM5354KFBG

Datasheet: BCM5354KFBG Datasheet (PDF)

Package/Case: FBGA361

Product Type: RF System on a Chip - SoC

RoHS Status:

Stock Condition: 6554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BCM5354KFBG or email to us: Email: [email protected], we will contact you within 12 hours.

BCM5354KFBG

Features

  • 240-MHz MIPS32® CPU core 16-KB instruction cache, 16-KB data cache, and 1-KB pre fetch cache Memory Management Unit (MMU) for high-level Real-Time Operating System (RTOS) support2.4-GHz direct conversion radioUSB 2.0 host controllerSDRAM controller 16-bit, 120-MHz SDRAM controller SDR and DDR support 2 MB to 128 MB capacitySupports serial or parallel flashFive-port integrated 10/100BASE-TX/FX IEEE 802.3u compliant Auto-MDIX transceivers and LAN/WAN switch controllerEight GPIOs for attachment to various external devices (example: LEDs)One JTAG and two UART ports for debugging development and attaching Data Terminal Equipment (DTE)0.13 um technology
  • SUMMARY OF BENEFITS
  • The BCM5354 achieves the lowest cost and highest performance router system-on-chip (SoC) integration for residential and small office, home office (SOHO) markets Time-to-market is significantly reduced through stable Linux® and VxWorks® kernels, board support packages (BSPs), drivers and toolchainsTurn-key software is code compatible with other AirForce™ routers and access points (APs) enabling seamless migration of proprietary featuresUSB host interface allows for platform expansion by end users and can support USB print server or Microsoft Windows® Connect Now functionalitySupports high-speed performance mode (HSM) of 125 Mbps that is backward–compatible with standard 802.11 b/gBroadRange™ signal processing technology enhances receive sensitivity resulting in excellent wireless throughput and range in a home and business environment

Specifications

Parameter Value Parameter Value
Manufacturer Broadcom Limited Product Category RF System on a Chip - SoC
Type Wi-Fi Brand Broadcom
Product Type RF System on a Chip - SoC Subcategory Wireless & RF Integrated Circuits
Technology Si

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BCM5354KFBG is a system-on-chip (SoC) designed by Broadcom for wireless networking applications. It integrates a MIPS processor, Ethernet switch, wireless LAN, and other peripherals onto a single chip, making it suitable for use in routers and access points. The chip supports Wi-Fi standards like 802.11b/g/n and provides robust connectivity solutions for various networking devices.
  • Equivalent

    Some equivalent products of BCM5354KFBG chip include BCM5354, BCM5354KFBG-P23, BCM5354KFBG-P10, BCM5354KFBG-P12, and BCM5354KFBG-P15. These chips are all part of the same series and offer similar features and functions.
  • Features

    BCM5354KFBG is a high-performance, integrated system-on-a-chip solution for wireless networking applications. It features a 300 MHz MIPS processor, 16 MB flash memory, 8 MB RAM, and integrated 2.4 GHz WLAN radios with up to 300 Mbps data rates. It also supports multiple security protocols and features to ensure reliable and secure wireless connectivity.
  • Pinout

    The pin count of BCM5354KFBG is 456 pins. It is a system on a chip (SoC) designed for wireless networking applications, featuring a MIPS32 CPU, integrated switch fabric, and Ethernet MAC interfaces. This chip is commonly used in routers, access points, and other networking devices.
  • Manufacturer

    Broadcom Limited is the manufacturer of BCM5354KFBG. It is a multinational technology company specializing in semiconductor and infrastructure software solutions. Broadcom is known for providing a wide range of products for various industries, including networking, wireless communications, and data center markets.
  • Application Field

    BCM5354KFBG is commonly used in wireless routers, access points, and other networking devices. It is suitable for residential and small business applications, providing reliable and high-speed internet connectivity. Its advanced features make it an ideal choice for home networks, small offices, and IoT devices.
  • Package

    The BCM5354KFBG chip is a surface mount package in the FBGA form. It measures 19mm x 19mm and has a 388-ball grid array. The package is designed for use in networking and communication applications, providing high-speed connectivity and performance.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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