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BROADCOM BCM43217TKMLG

Name: BCM43217TKMLG
Rating: 4.5 (10 reviews)

- Interface - Specialized ROHS

Brands: BROADCOM

Mfr.Part #: BCM43217TKMLG

Datasheet: BCM43217TKMLG Datasheet (PDF)

Package/Case: QFN

RoHS Status:

Stock Condition: 621 pcs, New Original

Product Type: RF Integrated Circuits

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty	Unit Price	Ext Price
1	$4.658	$4.658
200	$1.803	$360.600
500	$1.740	$870.000
1000	$1.709	$1709.000

In Stock:621 PCS

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Quick Quote

Please submit RFQ for BCM43217TKMLG or email to us: Email: [email protected], we will contact you within 12 hours.

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Remark

BCM43217TKMLG General Description

Interface

Specifications

Parameter	Value	Parameter	Value
Product Category	RF Transceiver	RoHS	Details
Type	802.11 n WLAN	Brand	Broadcom / Avago
Product Type	RF Transceiver	Factory Pack Quantity	2436
Subcategory	Wireless & RF Integrated Circuits

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The BCM43217TKMLG chip is a wireless communication chip manufactured by Broadcom, designed for use in various devices such as laptops, tablets, and smartphones. It supports multiple wireless technologies, including Wi-Fi 802.11n and Bluetooth, offering high-speed connectivity and reliable wireless performance. The chip is known for its power efficiency, compact size, and compatibility with different operating systems, making it a popular choice among device manufacturers.
Features

The BCM43217TKMLG is a wireless LAN (Wi-Fi) system-on-a-chip (SoC) that offers support for high-speed data transfer and advanced security features. It supports the 802.11n standard, multiple input multiple output (MIMO) technology, and features a wide range of power management options. It is designed to provide reliable and efficient wireless connectivity for various devices.
Pinout

The BCM43217TKMLG is a wireless LAN chip from Broadcom. It has 74 pins and functions as a single-chip IEEE 802.11n WLAN client device, supporting multiple-input and multiple-output (MIMO) configurations.
Manufacturer

The manufacturer of the BCM43217TKMLG is Broadcom Inc. It is a leading American semiconductor company that specializes in designing and producing a wide range of communication and connectivity solutions for various industries, including networking, wireless, and broadband.
Application Field

The BCM43217TKMLG is a wireless chip commonly used in routers and access points. It is designed for residential and small office applications, providing fast and reliable wireless connectivity. This chip can be used to connect devices such as smartphones, laptops, and smart home devices to a local network or the internet.
Package

The BCM43217TKMLG chip is a surface mount package type, with a form factor of BGA (Ball Grid Array). The package size of the chip is 7mm x 7mm, indicating its compact size.