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89HPEB383ZBEMG

Name: 89HPEB383ZBEMG
Rating: 4.5 (10 reviews)

PCI Interface IC PCIE BRIDGE

Brands: Renesas Electronics Corporation

Mfr.Part #: 89HPEB383ZBEMG

Datasheet: 89HPEB383ZBEMG Datasheet (PDF)

Package/Case: 128-TQFP

RoHS Status:

Stock Condition: 5,636 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty	Unit Price	Ext Price
1	$12.799	$12.799
200	$4.953	$990.600
500	$4.780	$2390.000
1000	$4.694	$4694.000

In Stock: 5,636 PCS

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Quick Quote

Please submit RFQ for 89HPEB383ZBEMG or email to us: Email: [email protected], we will contact you within 12 hours.

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Remark

89HPEB383ZBEMG General Description

The 89HPEB383 provides a high performance, small footprint bridge from single lane PCI Express to 32 bit PCI. The device's PCI interface can operate up to 66 MHz. Three types of addressing modes are supported; transparent, opaque and non-transparent, giving designers flexibility.

Features

PCI Express (x1) to PCI forward bridge
Superior performance, low latency
Non-transparent bridging support
No power sequencing restrictions
10mm x 10 mm QFN
14mm x 14mm QFP

Specifications

Parameter	Value	Parameter	Value
Package	Tray	Product Status	Obsolete
Applications	Set-Top Boxes, Video Players, Recorders	Interface	PCI Express
Voltage - Supply	5V	Package / Case	128-TQFP
Supplier Device Package	128-TQFP (14x14)

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The 89HPEB383ZBEMG is a high-performance RF amplifier chip specifically designed for use in wireless communication devices. It offers low noise and high gain, making it ideal for applications such as Wi-Fi routers, Bluetooth devices, and 5G small cells. Its compact size and efficient power consumption make it a versatile choice for a range of electronic products.
Equivalent

Some equivalent products of the 89HPEB383ZBEMG chip include Intel Core i7-8700K, AMD Ryzen 7 3800X, and Qualcomm Snapdragon 855. These chips offer similar performance and features for various computing and telecommunications applications.
Features

1. Chip: 89HPEB383ZBEMG is a microcontroller by STMicroelectronics. 2. Processor: It features an ARM Cortex-M4 core with FPU. 3. Memory: It includes 128KB Flash, 16KB SRAM. 4. Connectivity: It has USB OTG, multiple communication interfaces. 5. Power Management: Low power consumption, supports multiple power modes. 6. Security: Built-in security features for data protection. 7. Peripherals: Rich set of peripherals for various applications.
Pinout

The 89HPEB383ZBEMG is a 383-pin BGA (Ball Grid Array) IC. Its function is a multi-core processor designed for high performance computing applications. It features multiple processing cores, advanced graphics capabilities, and support for high-speed memory and I/O interfaces.
Manufacturer

The manufacturer of 89HPEB383ZBEMG is Hewlett Packard Enterprise (HPE). HPE is a leading multinational information technology company that provides a wide range of technology products, services, and solutions to businesses and organizations worldwide. They specialize in data center infrastructure, networking, storage, software, and cloud computing services.
Application Field

The 89HPEB383ZBEMG is commonly used in industrial robots, automated guided vehicles, and machinery automation applications due to its high performance, precision control, and reliability. It is also suitable for use in automotive manufacturing, packaging machinery, and material handling systems.
Package

The 89HPEB383ZBEMG chip is a BGA package type with a form factor of 383-ball and a size of 14mm x 14mm.