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XCF128XFTG64C 48HRS

FTBGA-64 XCF128XFTG64C is a reliable and efficient choice for programmable logic designs

ISO14001 ISO9001 DUNS

Brands: Xilinx

Mfr.Part #: XCF128XFTG64C

Datasheet: XCF128XFTG64C Datasheet (PDF)

Package/Case: FTBGA-64

RoHS Status:

Stock Condition: 8,592 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $82.404 $82.404
200 $36.482 $7296.400
500 $35.463 $17731.500
1000 $34.959 $34959.000

In Stock: 8,592 PCS

- +

Quick Quote

Please submit RFQ for XCF128XFTG64C or email to us: Email: [email protected], we will contact you within 12 hours.

XCF128XFTG64C General Description

The XCF128XFTG64C is a Flash memory device primarily used in embedded systems and other electronic applications. It belongs to the XCF (eXtra CompactFlash) series manufactured by a reputable semiconductor company. Here are the key details:1. **Capacity**: It has a storage capacity of 128 megabits (Mb), which is equivalent to 16 megabytes (MB).2. **Technology**: Utilizes Flash memory technology for non-volatile data storage, allowing data to be retained even when power is removed.3. **Package**: Comes in a compact form factor, likely using a Ball Grid Array (BGA) package, facilitating integration into small electronic devices.4. **Operating Voltage**: Operates within a specified voltage range, typically in the low voltage range to suit various power requirements of embedded systems.5. **Speed**: Offers fast read and write speeds suitable for applications requiring quick access to data.6. **Temperature Range**: Designed to operate reliably within a specific temperature range, ensuring functionality in various environmental conditions.

XCF128XFTG64C

Features

  • 128Mbit of density
  • Wide voltage operation (2.7V to 3.6V)
  • Extended temperature range (-40°C to 85°C)
  • Fast read and program operations
  • 64-ball WLCSP package

Application

  • Industrial control systems
  • Telecommunications equipment
  • Automotive systems
  • Medical devices
  • Field-programmable gate arrays (FPGAs)
  • Networking devices
  • Smart grid applications
  • Aerospace and defense systems
  • Robotics
  • Home automation

Specifications

Parameter Value Parameter Value
Product Category FPGA - Configuration Memory RoHS Details
Memory Type EEPROM Memory Size 128 Mbit
Maximum Operating Frequency 54 MHz Operating Supply Voltage 1.8 V
Minimum Operating Temperature - 40 C Maximum Operating Temperature + 85 C
Mounting Style SMD/SMT Package / Case FTBGA-64
Brand Xilinx Moisture Sensitive Yes
Operating Supply Current 33 mA Product Type FPGA - Configuration Memory
Series XCF128X Factory Pack Quantity 1
Subcategory Programmable Logic ICs Supply Voltage - Max 2 V
Supply Voltage - Min 1.7 V

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCF128XFTG64C is a high-performance Field-Programmable Gate Array (FPGA) chip from Xilinx. It offers 128,000 logic cells, 2048 DSP slices, and 48 MB of ultrafast serial and parallel memory. It is designed for demanding applications in industries such as aerospace, automotive, and telecommunications.
  • Equivalent

    The equivalent products of XCF128XFTG64C chip are XCF128XFTG64B, XCF128XFTG64D, XCF128XFTG64E, and XCF128XFTG64F. These chips have similar specifications and functionalities, making them suitable replacements for the XCF128XFTG64C chip.
  • Features

    - 128Mb SPI serial NOR Flash memory - Fast read speeds up to 166 MHz - High reliability and endurance with 100,000 program/erase cycles - Wide operating voltage range of 2.7V to 3.6V - Industrial temperature range of -40°C to 85°C - RoHS compliant and lead-free technology
  • Pinout

    The XCF128XFTG64C is a 64-ball Fine-pitch BGA (FBGA) package with a pin count of 64. It is a Flash memory device with a capacity of 128 megabits (16 megabytes) and supports various functions like storing program code and data for electronic devices.
  • Manufacturer

    The manufacturer of XCF128XFTG64C is Xilinx, Inc. It is an American technology company specializing in the development of programmable devices and associated technologies, such as field-programmable gate arrays (FPGAs) and system on chips (SoCs). Xilinx's products are used in various industries, including aerospace, automotive, telecommunications, and data centers.
  • Application Field

    The XCF128XFTG64C is commonly used in applications such as automotive, industrial, communication, and consumer electronics. It is ideal for use in applications that require high-performance processing, low power consumption, and reliability, making it suitable for a wide range of embedded systems and devices.
  • Package

    The XCF128XFTG64C chip is a BG256 package type in a form factor of a 16x16mm grid array. It has a size of 15x15mm with a 1mm ball pitch.

We provide high quality products, thoughtful service and after sale guarantee

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  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

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  • guarantee

    365 days quality guarantee for all products

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