Orders Over
$5000XCF128XFTG64C
FTBGA-64 XCF128XFTG64C is a reliable and efficient choice for programmable logic designs
Brands: Xilinx
Mfr.Part #: XCF128XFTG64C
Datasheet: XCF128XFTG64C Datasheet (PDF)
Package/Case: FTBGA-64
RoHS Status:
Stock Condition: 8,592 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $82.404 | $82.404 |
200 | $36.482 | $7296.400 |
500 | $35.463 | $17731.500 |
1000 | $34.959 | $34959.000 |
In Stock: 8,592 PCS
XCF128XFTG64C General Description
The XCF128XFTG64C is a Flash memory device primarily used in embedded systems and other electronic applications. It belongs to the XCF (eXtra CompactFlash) series manufactured by a reputable semiconductor company. Here are the key details:1. **Capacity**: It has a storage capacity of 128 megabits (Mb), which is equivalent to 16 megabytes (MB).2. **Technology**: Utilizes Flash memory technology for non-volatile data storage, allowing data to be retained even when power is removed.3. **Package**: Comes in a compact form factor, likely using a Ball Grid Array (BGA) package, facilitating integration into small electronic devices.4. **Operating Voltage**: Operates within a specified voltage range, typically in the low voltage range to suit various power requirements of embedded systems.5. **Speed**: Offers fast read and write speeds suitable for applications requiring quick access to data.6. **Temperature Range**: Designed to operate reliably within a specific temperature range, ensuring functionality in various environmental conditions.
Features
- 128Mbit of density
- Wide voltage operation (2.7V to 3.6V)
- Extended temperature range (-40°C to 85°C)
- Fast read and program operations
- 64-ball WLCSP package
Application
- Industrial control systems
- Telecommunications equipment
- Automotive systems
- Medical devices
- Field-programmable gate arrays (FPGAs)
- Networking devices
- Smart grid applications
- Aerospace and defense systems
- Robotics
- Home automation
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Category | FPGA - Configuration Memory | RoHS | Details |
Memory Type | EEPROM | Memory Size | 128 Mbit |
Maximum Operating Frequency | 54 MHz | Operating Supply Voltage | 1.8 V |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 85 C |
Mounting Style | SMD/SMT | Package / Case | FTBGA-64 |
Brand | Xilinx | Moisture Sensitive | Yes |
Operating Supply Current | 33 mA | Product Type | FPGA - Configuration Memory |
Series | XCF128X | Factory Pack Quantity | 1 |
Subcategory | Programmable Logic ICs | Supply Voltage - Max | 2 V |
Supply Voltage - Min | 1.7 V |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCF128XFTG64C is a high-performance Field-Programmable Gate Array (FPGA) chip from Xilinx. It offers 128,000 logic cells, 2048 DSP slices, and 48 MB of ultrafast serial and parallel memory. It is designed for demanding applications in industries such as aerospace, automotive, and telecommunications.
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Equivalent
The equivalent products of XCF128XFTG64C chip are XCF128XFTG64B, XCF128XFTG64D, XCF128XFTG64E, and XCF128XFTG64F. These chips have similar specifications and functionalities, making them suitable replacements for the XCF128XFTG64C chip. -
Features
- 128Mb SPI serial NOR Flash memory - Fast read speeds up to 166 MHz - High reliability and endurance with 100,000 program/erase cycles - Wide operating voltage range of 2.7V to 3.6V - Industrial temperature range of -40°C to 85°C - RoHS compliant and lead-free technology -
Pinout
The XCF128XFTG64C is a 64-ball Fine-pitch BGA (FBGA) package with a pin count of 64. It is a Flash memory device with a capacity of 128 megabits (16 megabytes) and supports various functions like storing program code and data for electronic devices. -
Manufacturer
The manufacturer of XCF128XFTG64C is Xilinx, Inc. It is an American technology company specializing in the development of programmable devices and associated technologies, such as field-programmable gate arrays (FPGAs) and system on chips (SoCs). Xilinx's products are used in various industries, including aerospace, automotive, telecommunications, and data centers. -
Application Field
The XCF128XFTG64C is commonly used in applications such as automotive, industrial, communication, and consumer electronics. It is ideal for use in applications that require high-performance processing, low power consumption, and reliability, making it suitable for a wide range of embedded systems and devices. -
Package
The XCF128XFTG64C chip is a BG256 package type in a form factor of a 16x16mm grid array. It has a size of 15x15mm with a 1mm ball pitch.
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