TOSHIBA TLP291-4(TP,E)

Part points

• The TLP291-4(TP,E) chip is a photocoupler device designed to transfer electrical signals between two circuits, while providing electrical isolation. It consists of an infrared LED and a phototransistor in a single package. The LED emits infrared light that is detected by the phototransistor, allowing data transmission without direct electrical connection. This chip is commonly used in applications requiring noise immunity and protection against voltage spikes and surges.

• Equivalent

  The equivalent products of the TLP291-4(TP,E) chip are PC123, FOD814, ILQ615, and PS2501L-1-F3-A.

• Features

  The TLP291-4(TP,E) is a photovoltaic relay that operates in a 4-pin DIP package. Key features include a low input power requirement, high off-state output terminal voltage, high operating temperature range, and high sensitivity. It is commonly used in industrial applications such as programmable logic controllers and temperature controllers.

• Pinout

  The TLP291-4(TP,E) is a photocoupler optoisolator. It has a 16-pin DIP package and its pin count and function are as follows: pins 1, 2, 4, 5, 10, 11, 13, and 14 are connected to the photo-transistor's emitter, collector, and base respectively, pins 3, 6, 7, 8, 9, 12, 15, and 16 are connected to the LED's cathode, anode, NC, NC, NC, NC, NC, and NC respectively.

• Manufacturer

  The manufacturer of the TLP291-4(TP,E) is Toshiba Corporation. Toshiba Corporation is a Japanese multinational conglomerate company. Founded in 1939, it specializes in a wide range of products and services, including consumer electronics, electrical equipment, and semiconductors.

• Application Field

  The TLP291-4(TP,E) optocoupler is commonly used in various applications such as digital logic signals isolation, high-speed communication interfaces, power supply feedback control, and motor control circuits. Additionally, it can be used to provide isolation and voltage level shifting in different industrial and commercial systems.

• Package

  The TLP291-4(TP,E) chip is a surface mount package type with a 16-pin DIP (dual in-line package) form, measuring approximately 19.8mm x 6.5mm x 6.3mm in size.