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SPANSION S29AL016J70BFI020 48HRS

Reliable 16Mb 70ns Parallel NOR Flash

ISO14001 ISO9001 DUNS

Brands: SPANSION

Mfr.Part #: S29AL016J70BFI020

Datasheet: S29AL016J70BFI020 Datasheet (PDF)

Package/Case: BGA

RoHS Status:

Stock Condition: 3902 pcs, New Original

Product Type: Memory

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $2.661 $2.661
10 $2.308 $23.080
30 $2.087 $62.610
100 $1.669 $166.900
338 $1.567 $529.646
1014 $1.522 $1543.308

In Stock:3902 PCS

- +

Quick Quote

Please submit RFQ for S29AL016J70BFI020 or email to us: Email: [email protected], we will contact you within 12 hours.

S29AL016J70BFI020 General Description

The S29AL016J70BFI020 is a flash memory chip manufactured by Cypress Semiconductor. It belongs to the family of 16-megabit (Mb) NOR flash memories. The "S" in the name denotes the company's serial flash memory series. Its 70 nanosecond (ns) access time ensures relatively fast data retrieval. With a supply voltage range of 2.7 to 3.6 volts, it operates efficiently within standard voltage parameters. The "BFI020" in the part number indicates the package type, specifically a 48-ball Fine-Pitch Ball Grid Array (FBGA) package. This chip offers reliable and high-performance non-volatile storage solutions, commonly used in various electronic devices, including consumer electronics, automotive applications, and industrial equipment. It provides a balance of capacity, speed, and voltage flexibility suitable for a wide range of embedded systems and applications requiring flash memory storage

Features

  • 16Mbit (1M x 16) Flash memory
  • 70ns access time
  • 2.7V to 3.6V operating voltage range
  • Byte/word erase and program operations
  • 20-year data retention
  • Industrial temperature range (-40°C to 85°C)
  • 48-ball fine pitch ball grid array (FBGA) package

Application

  • Embedded systems
  • Automotive electronics
  • Industrial applications
  • Telecommunication equipment
  • Consumer electronics
  • Medical devices
  • Networking equipment
  • Gaming devices
  • IoT devices
  • Security systems
SPANSION Inventory

Specifications

Parameter Value Parameter Value
functionalPacking TRAY addProductInfo 16Mb 3V Parallel -40Cto85C
packageNameMarketing VFBGA-48 (002-19063) msl 3
halogenFree undefined customerInfo STANDARD
fgr Q28 productClassification ASP
productStatusInfo active and preferred hfgr 1
packageName PG-VFBGA-48 pbFree yes
moistureProtPack DRY orderingCode SP005672995
fourBlockPackageName PG-VFBGA-48-802 rohsCompliant yes
opn S29AL016J70BFI020 completelyPbFree undefined
sapMatnrSali SP005672995

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The S29AL016J70BFI020 chip is a flash memory device manufactured by Cypress Semiconductor. It has a storage capacity of 16 Megabits (2 Megabytes) and operates at a voltage range of 2.7V to 3.6V. The chip belongs to the S29AL-J family and uses the MirrorBit technology, providing high performance and reliability for various applications such as automotive electronics, industrial control systems, and consumer electronics.
  • Features

    S29AL016J70BFI020 is a 16 megabit, 3.0-volt NOR Flash memory with a page-programming architecture. It offers superior performance, reliability, and low power consumption while supporting standard commands and simple execution. It has a sector-based architecture, fast program and erase times, and is compatible with the existing JEDEC standards.
  • Pinout

    The S29AL016J70BFI020 has a 48-pin count. It is a 16Mb (2M x 8/1M x 16) CMOS Boot Sector Flash Memory, and is used in various applications like telecommunications, networking, and industrial equipment.
  • Manufacturer

    The manufacturer of the S29AL016J70BFI020 is Cypress Semiconductor Corporation. Cypress Semiconductor is an American semiconductor design and manufacturing company. They specialize in the production of various integrated circuits, microcontrollers, and other semiconductor devices used in a wide range of applications, including automotive, industrial, consumer electronics, and more.
  • Application Field

    The S29AL016J70BFI020 is a 16-megabit (2 megabyte) flash memory device. It can be used in various application areas, including consumer electronics, automotive, industrial, and communications. It is commonly used for storing firmware, program code, data, and other digital information in these applications.
  • Package

    The S29AL016J70BFI020 chip is packaged in a TSOP (Thin Small Outline Package) type. The form factor is Type I or Type VI, and the size is 14 mm x 20 mm for Type I or 12 mm x 20 mm for Type VI.

Datasheet PDF

Preliminary Specification S29AL016J70BFI020 PDF Download

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