Intel RC28F160C3BD70
FLASH - Boot Block Memory IC 16Mbit Parallel 70 ns 64-EasyBGA (10x13)
Brands: Intel Corp
Mfr.Part #: RC28F160C3BD70
Datasheet: RC28F160C3BD70 Datasheet (PDF)
Package/Case: BGA-64
Product Type: Integrated Circuits (ICs)
RC28F160C3BD70 General Description
FLASH - Boot Block Memory IC 16Mbit Parallel 70 ns 64-EasyBGA (10x13)
Features
- Organization: 16Mbits (2Mbytes) x 8 bits
- Supply voltage: 2.7V to 3.6V
- Access time: 70 ns
- Low standby current: 5 µA typical
- Sector architecture: One 16 KByte, three 8 KByte, one 32 KByte, five 64 KByte, and twenty-eight 128 KByte sectors
- Interface: Asynchronous, JEDEC-standard pinout
Application
- Embedded systems
- Consumer electronics
- Communications equipment
- Automotive systems
- Industrial control systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
place | launch_date | Mar 12, 2008 | |
last_inspection_date | +90 | rohs_version | 2011/65/EU, 2015/863 |
supplier_cage_code | 6Y440 | htsusa | 8542320071 |
schedule_b | 8542320070 | ppap | |
aec |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the RC28F160C3BD70 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Spansion
Brands :
Package :
Description : S29AL016J70TFI02
Part points
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The RC28F160C3BD70 is a 16-megabit flash memory chip produced by Intel. It offers high-speed read and write operations, as well as low power consumption. The chip is commonly used in various consumer electronics devices, such as smartphones, tablets, and digital cameras.
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Equivalent
Some equivalent products of the RC28F160C3BD70 chip are AT49BV1604T, M29W160EB, and S29GL01GP. These chips have similar specifications and functionality, making them potential alternatives for the RC28F160C3BD70 in certain applications. -
Features
The RC28F160C3BD70 is a 16-megabit (2 MB) flash memory chip with a capacity for storing data. It has a page size of 528 bytes and a sector size of 16 KB. It operates on a 2.7V to 3.6V power supply and has a 70 ns access time. -
Pinout
The RC28F160C3BD70 has a 48-pin count and is a Flash memory IC. It is mainly used for storing and retrieving data in electronic devices, such as computers, smartphones, and other digital devices. -
Manufacturer
The manufacturer of the RC28F160C3BD70 is Intel Corporation. Intel is an American multinational corporation that is one of the world's largest and highest-valued semiconductor chip makers. They are known for designing and manufacturing a wide range of products, including processors, memory, and other integrated circuits for a variety of devices. -
Application Field
The RC28F160C3BD70 is commonly used in industrial applications, automotive electronics, medical devices, and communication systems. It can be found in applications that require high-capacity data storage, reliable performance, and low power consumption. -
Package
The RC28F160C3BD70 chip is in a BGA (Ball Grid Array) package, with a form factor of integrated circuit and a size of 11mm x 14mm.
Datasheet PDF
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