NT5CB64M16FP-DH
DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, TFBGA-96
Brands: Nanya Technology Corporation
Mfr.Part #: NT5CB64M16FP-DH
Datasheet: NT5CB64M16FP-DH Datasheet (PDF)
Package/Case: FBGA96
Product Type: DDR3
NT5CB64M16FP-DH General Description
The NT5CB64M16FP-DH is a specific part number for a memory chip. It is a synchronous dynamic random-access memory (SDRAM) module with a capacity of 1 Gigabit (64 Megabytes). It is designed to be used in electronic devices such as computers, laptops, and other devices that require high-speed data storage.
Features
- Synchronous operation with a clock frequency of 166 MHz (max)
- Double-data-rate (DDR) architecture for high-speed data transfer
- Low power consumption
- 64-bit wide data bus for efficient data access
- Multiplexed row and column address for simplified addressing scheme
- Burst mode operation for continuous data transfer
- On-die termination (ODT) for improved signal integrity
- RoHS compliant and lead-free package
Application
- The NT5CB64M16FP-DH memory chip is commonly used in various applications that require high-performance memory, including:
- Desktop and laptop computers
- Servers and data centers
- Gaming consoles and graphics cards
- Networking equipment
- Medical devices
- Industrial automation systems
- Telecommunications equipment
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Rohs Code | Yes | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | NANYA TECHNOLOGY CORP | Package Description | TFBGA, BGA96,9X16,32 |
Reach Compliance Code | compliant | ECCN Code | EAR99 |
HTS Code | 8542.32.00.32 | Access Mode | MULTI BANK PAGE BURST |
Access Time-Max | 0.225 ns | Additional Feature | AUTO/SELF REFRESH |
Clock Frequency-Max (fCLK) | 800 MHz | I/O Type | COMMON |
Interleaved Burst Length | 8 | JESD-30 Code | R-PBGA-B96 |
Length | 13 mm | Memory Density | 1073741824 bit |
Memory IC Type | DDR3 DRAM | Memory Width | 16 |
Number of Functions | 1 | Number of Ports | 1 |
Number of Terminals | 96 | Number of Words | 67108864 words |
Number of Words Code | 64000000 | Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
Organization | 64MX16 | Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Qualification Status | Not Qualified | Refresh Cycles | 8192 |
Seated Height-Max | 1.2 mm | Self Refresh | YES |
Sequential Burst Length | 8 | Standby Current-Max | 0.011 A |
Supply Current-Max | 0.2 mA | Supply Voltage-Max (Vsup) | 1.575 V |
Supply Voltage-Min (Vsup) | 1.425 V | Supply Voltage-Nom (Vsup) | 1.5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Width | 9 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US$0.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Key points
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The NT5CB64M16FP-DH is a type of memory chip commonly used in electronic devices such as computers, smartphones, and gaming consoles. It has a capacity of 64 megabytes (MB) and is based on DDR4 technology. This chip is designed to provide fast and reliable data storage and retrieval, making it suitable for high-performance applications.
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Equivalent
Equivalent products of the NT5CB64M16FP-DH chip include NT5CB64M16DP-DH and NT5CB64M16EP-DH. -
Features
The NT5CB64M16FP-DH is a DDR3 SDRAM device with a capacity of 1G x 16 bits. It operates at a low power supply voltage and offers a high-speed performance. The device is designed for use in a variety of applications, including digital televisions, set-top boxes, and automotive infotainment systems. -
Pinout
The NT5CB64M16FP-DH is a DDR3L SDRAM chip with a pin count of 96. It is 2G x 16-bit I/O and operates at 1.35V. The chip is commonly used in applications like data storage devices, computer systems, and networking equipment. -
Manufacturer
The manufacturer of the NT5CB64M16FP-DH is Nanya Technology Corporation. It is a Taiwanese company that specializes in the manufacturing of dynamic random-access memory (DRAM) products. -
Application Field
The NT5CB64M16FP-DH is a DDR3 SDRAM module used in computer systems to provide high-speed memory storage and retrieval. It can be utilized in various application areas, including personal computers, servers, workstations, and other devices that require fast and reliable memory performance. -
Package
The NT5CB64M16FP-DH chip comes in a BGA (Ball Grid Array) package type. It has a form factor of FBGA (Fine Ball Grid Array) and a size of 11x9mm, which refers to the dimensions of the chip itself.
We provide high quality products, thoughtful service and after sale guarantee
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Minimum order quantity starts from 1pcs.
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