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NT5CB64M16FP-DH

DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, TFBGA-96

Ovaga Certification

Brands: Nanya Technology Corporation

Mfr.Part #: NT5CB64M16FP-DH

Datasheet: NT5CB64M16FP-DH Datasheet (PDF)

Package/Case: FBGA96

Product Type: DDR3

RoHS Status:

Stock Condition: 958 pcs, New Original

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Please submit RFQ for NT5CB64M16FP-DH or email to us: Email: [email protected], we will contact you within 12 hours.

NT5CB64M16FP-DH General Description

The NT5CB64M16FP-DH is a specific part number for a memory chip. It is a synchronous dynamic random-access memory (SDRAM) module with a capacity of 1 Gigabit (64 Megabytes). It is designed to be used in electronic devices such as computers, laptops, and other devices that require high-speed data storage.

NT5CB64M16FP-DH

Features

  • Synchronous operation with a clock frequency of 166 MHz (max)
  • Double-data-rate (DDR) architecture for high-speed data transfer
  • Low power consumption
  • 64-bit wide data bus for efficient data access
  • Multiplexed row and column address for simplified addressing scheme
  • Burst mode operation for continuous data transfer
  • On-die termination (ODT) for improved signal integrity
  • RoHS compliant and lead-free package
NT5CB64M16FP-DH

Application

  • The NT5CB64M16FP-DH memory chip is commonly used in various applications that require high-performance memory, including:
  • Desktop and laptop computers
  • Servers and data centers
  • Gaming consoles and graphics cards
  • Networking equipment
  • Medical devices
  • Industrial automation systems
  • Telecommunications equipment

Specifications

Parameter Value Parameter Value
Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer NANYA TECHNOLOGY CORP Package Description TFBGA, BGA96,9X16,32
Reach Compliance Code compliant ECCN Code EAR99
HTS Code 8542.32.00.32 Access Mode MULTI BANK PAGE BURST
Access Time-Max 0.225 ns Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz I/O Type COMMON
Interleaved Burst Length 8 JESD-30 Code R-PBGA-B96
Length 13 mm Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM Memory Width 16
Number of Functions 1 Number of Ports 1
Number of Terminals 96 Number of Words 67108864 words
Number of Words Code 64000000 Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C Operating Temperature-Min
Organization 64MX16 Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY Package Code TFBGA
Package Equivalence Code BGA96,9X16,32 Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Refresh Cycles 8192
Seated Height-Max 1.2 mm Self Refresh YES
Sequential Burst Length 8 Standby Current-Max 0.011 A
Supply Current-Max 0.2 mA Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Form BALL
Terminal Pitch 0.8 mm Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US$0.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Key points

  • The NT5CB64M16FP-DH is a type of memory chip commonly used in electronic devices such as computers, smartphones, and gaming consoles. It has a capacity of 64 megabytes (MB) and is based on DDR4 technology. This chip is designed to provide fast and reliable data storage and retrieval, making it suitable for high-performance applications.
  • Equivalent

    Equivalent products of the NT5CB64M16FP-DH chip include NT5CB64M16DP-DH and NT5CB64M16EP-DH.
  • Features

    The NT5CB64M16FP-DH is a DDR3 SDRAM device with a capacity of 1G x 16 bits. It operates at a low power supply voltage and offers a high-speed performance. The device is designed for use in a variety of applications, including digital televisions, set-top boxes, and automotive infotainment systems.
  • Pinout

    The NT5CB64M16FP-DH is a DDR3L SDRAM chip with a pin count of 96. It is 2G x 16-bit I/O and operates at 1.35V. The chip is commonly used in applications like data storage devices, computer systems, and networking equipment.
  • Manufacturer

    The manufacturer of the NT5CB64M16FP-DH is Nanya Technology Corporation. It is a Taiwanese company that specializes in the manufacturing of dynamic random-access memory (DRAM) products.
  • Application Field

    The NT5CB64M16FP-DH is a DDR3 SDRAM module used in computer systems to provide high-speed memory storage and retrieval. It can be utilized in various application areas, including personal computers, servers, workstations, and other devices that require fast and reliable memory performance.
  • Package

    The NT5CB64M16FP-DH chip comes in a BGA (Ball Grid Array) package type. It has a form factor of FBGA (Fine Ball Grid Array) and a size of 11x9mm, which refers to the dimensions of the chip itself.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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