N25Q256A13EF840F
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 8-Pin VPDFN EP T/R
Brands: MICRON TECHNOLOGY INC
Mfr.Part #: N25Q256A13EF840F
Datasheet: N25Q256A13EF840F Datasheet (PDF)
Package/Case: 8-VDFPN (MLP8) (8x6)
Product Type: NOR Flash
RoHS Status:
Stock Condition: 6705 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 8ns 8-Pin VPDFN EP T/R
Features
- The memory is organized as 512 (64KB) main sectors that are further divided into 16 subsectors each (8192 subsectors in total). The memory can be erased one 4KB subsector at a time, 64KB sectors at a time, or as a whole.
- The memory can be write protected by software through volatile and nonvolatile protection features, depending on the application needs. The protection granularity is of 64KB (sector granularity) for volatile protections
- The device has 64 one-time programmable (OTP) bytes that can be read and programmed with the READ OTP and PROGRAM OTP commands. These 64 bytes can also be permanently locked with a PROGRAM OTP command.
- The device also has the ability to pause and resume PROGRAM and ERASE cycles by us ing dedicated PROGRAM/ERASE SUSPEND and RESUME instructions.
Specifications
Parameter | Value | Parameter | Value |
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Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Obsolete | Ihs Manufacturer | MICRON TECHNOLOGY INC |
Part Package Code | DFN | Package Description | VDFN-8 |
Pin Count | 8 | Reach Compliance Code | compliant |
ECCN Code | EAR99 | HTS Code | 8542.32.00.51 |
Samacsys Manufacturer | Micron | Additional Feature | SPI-COMPATIBLE SERIAL BUS INTERFACE |
Clock Frequency-Max (fCLK) | 108 MHz | Data Retention Time-Min | 20 |
Endurance | 100000 Write/Erase Cycles | JESD-30 Code | R-PDSO-N8 |
Length | 8 mm | Memory Density | 268435456 bit |
Memory IC Type | FLASH | Memory Width | 8 |
Number of Functions | 1 | Number of Terminals | 8 |
Number of Words | 33554432 words | Number of Words Code | 32000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | Organization | 32MX8 |
Package Body Material | PLASTIC/EPOXY | Package Code | HVSON |
Package Equivalence Code | SOLCC8,.3 | Package Shape | RECTANGULAR |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Parallel/Serial | SERIAL |
Peak Reflow Temperature (Cel) | 260 | Programming Voltage | 3 V |
Qualification Status | Not Qualified | Seated Height-Max | 1 mm |
Serial Bus Type | SPI | Standby Current-Max | 0.0001 A |
Supply Current-Max | 0.02 mA | Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V | Supply Voltage-Nom (Vsup) | 3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Form | NO LEAD |
Terminal Pitch | 1.27 mm | Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | 30 | Type | NOR TYPE |
Width | 6 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The N25Q256A13EF840F chip is a high-performance, high-capacity serial Flash memory component from Micron Technology. It offers 256Mb of storage capacity, fast read and write speeds, and is commonly used in various embedded applications such as smartphones, tablets, and IoT devices.
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Equivalent
Some equivalent products to the N25Q256A13EF840F chip are the MX25L25673G, S25FL256LAGMFI011, and W25Q256FWSIG chips. These chips provide similar functions and features, allowing for compatibility in various applications and systems. -
Features
N25Q256A13EF840F is a 256Mb NOR Flash memory with a serial peripheral interface. It features a 4KB uniform sector architecture, high-speed clock frequency up to 133MHz, low power consumption, and advanced security features. It is suitable for applications requiring high performance, reliability, and security. -
Pinout
The N25Q256A13EF840F is a 8-lead SOIC flash memory IC with a 208-mil wide body package. It has a 16-pin count and is used for storing data in various electronic devices. It provides high-speed read and write operations along with low power consumption. -
Manufacturer
The N25Q256A13EF840F is manufactured by Micron Technology, Inc., a multinational company specializing in computer memory and data storage. Micron is a leading provider of advanced semiconductor solutions, including DRAM, NAND, and NOR flash memory products, used in a variety of industries such as computing, automotive, and telecommunications. -
Application Field
The N25Q256A13EF840F is typically used in applications such as networking, industrial, automotive, and consumer electronics for storing firmware, boot code, configuration data, and application code. It is particularly well-suited for high-performance systems requiring low power consumption and fast read and program operations. -
Package
The N25Q256A13EF840F chip comes in a WSON-8 package with a form factor of 8-SMD. It has a size of 8Mb x 32, with a total of 256Mb.
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