MICRON MT47H128M8CF-25E:H

Part points

• The MT47H128M8CF-25E:H is a memory chip with a capacity of 128 megabytes. It operates at a speed of 266 MHz and has a voltage rating of 2.5V. The "H" in the model number denotes that it is a DDR3L SDRAM chip. This chip is commonly used in various electronic devices requiring high-speed and reliable memory storage.

• Equivalent

  The equivalent products of the MT47H128M8CF-25E:H chip are the MT47H128M8SH-25E:H and MT47H128M8BT-25E:H chips.

• Features

  The main features of the MT47H128M8CF-25E:H are: - Clock frequency of 250 MHz - Storage capacity of 128 megabits (16 megabytes) - Configuration as 8M x 16 x 8 banks - Operating voltage range of 1.7V to 1.95V - Industrial temperature range of -40°C to +85°C - Using DDR2 SDRAM technology - RoHS compliant packaging - Designed for high-performance computing and networking applications.

• Pinout

  The MT47H128M8CF-25E:H is a DDR3 SDRAM chip with a pin count of 78. It functions as a high-density memory module used for various applications requiring high-speed data transfer and storage.

• Manufacturer

  The manufacturer of the MT47H128M8CF-25E:H is Micron Technology, Inc. Micron is a multinational company that specializes in the production of memory and storage solutions for computers, mobile devices, and other electronic devices. They offer a wide range of products including DRAM, NAND flash memory, and solid-state drives, serving various industries such as automotive, networking, and consumer electronics.

• Application Field

  The MT47H128M8CF-25E:H is a type of memory module commonly used in computers and other electronic devices. It is primarily used in applications such as data storage, gaming, multimedia, and networking. It is also used in high-performance computing systems and servers that require fast and reliable memory capabilities.

• Package

  The MT47H128M8CF-25E:H chip has a package type of FBGA (Fine-pitch Ball Grid Array), form factor is 78-ball, and size of 9mm x 10.5mm.