Orders Over
$5000MSP430FR5962IRGZR
16-bit Microcontrollers - MCU 16MHz Ultra-Low-Pwr MCU with 128 KB FRAM
Brands: TEXAS INSTRUMENTS INC
Mfr.Part #: MSP430FR5962IRGZR
Datasheet: MSP430FR5962IRGZR Datasheet (PDF)
Package/Case: VQFN-48
Product Type: Microcontrollers
RoHS Status:
Stock Condition: 6,554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
MSP430FR5962IRGZR General Description
The MSP430FR599x microcontrollers (MCUs) take low power and performance to the next level with the unique low-energy accelerator (LEA) for digital signal processing. This accelerator delivers 40x the performance of Arm® Cortex®-M0+ MCUs to help developers efficiently process data using complex functions such as FFT, FIR, and matrix multiplication. Implementation requires no DSP expertise with a free optimized DSP Library available. Additionally, with up to 256KB of unified memory with FRAM, these devices offer more space for advanced applications and flexibility for effortless implementation of over-the-air firmware updates.
The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.
MSP430FR599x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits for the MSP430FR599x include the MSP-EXP430FR5994 LaunchPad™ development kit and the MSP-TS430PN80B 80-pin target development board. TI also provides free MSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer.
For complete module descriptions, see the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family Users Guide .
Features
- Embedded microcontroller
- 16-bit RISC architecture up to 16‑MHz clock
- Up to 256KB of ferroelectric random access memory (FRAM)
- Ultra-low-power writes
- Fast write at 125 ns per word (64KB in 4 ms)
- Flexible allocation of data and application code in memory
- 1015 write cycle endurance
- Radiation resistant and nonmagnetic
- Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
- Optimized ultra-low-power modes
- Active mode: 118 µA/MHz
- Standby with VLO (LPM3): 500 nA
- Standby with real-time clock (RTC) (LPM3.5): 350 nA (the RTC is clocked by a 3.7-pF crystal)
- Shutdown (LPM4.5): 45 nA
- Low-energy accelerator (LEA) for signal processing (MSP430FR599x only)
- Operation independent of CPU
- 4KB of RAM shared with CPU
- Efficient 256-point complex FFT: Up to 40x faster than Arm Cortex-M0+ core
- Intelligent digital peripherals
- 32-bit hardware multiplier (MPY)
- 6-channel internal DMA
- RTC with calendar and alarm functions
- Six 16-bit timers with up to seven capture/compare registers each
- 32- and 16-bit cyclic redundancy check (CRC)
- High-performance analog
- 16-channel analog comparator
- 12-bit analog-to-digital converter (ADC) featuring window comparator, internal reference and sample-and-hold, up to 20 external input channels
- Multifunction input/output ports
- All pins support capacitive-touch capability with no need for external components
- Accessible bit-, byte-, and word-wise (in pairs)
- Edge-selectable wake from LPM on all ports
- Programmable pullup and pulldown on all ports
- Code security and encryption
- 128- or 256-bit AES security encryption and decryption coprocessor
- Random number seed for random number generation algorithms
- IP encapsulation protects memory from external access
- Enhanced serial communication
- Up to four eUSCI_A serial communication ports
- UART with automatic baud-rate detection
- IrDA encode and decode
- Up to four eUSCI_B serial communication ports
- I2C with multiple-slave addressing
- Hardware UART or I2C bootloader (BSL)
- Up to four eUSCI_A serial communication ports
- Flexible clock system
- Fixed-frequency DCO with 10 selectable factory-trimmed frequencies
- Low-power low-frequency internal clock source (VLO)
- 32-kHz crystals (LFXT)
- High-frequency crystals (HFXT)
- Development tools and software (also see Tools and Software)
- Development kits (MSP-EXP430FR5994 LaunchPad™ development kit and MSP‑TS430PN80B target socket board)
- MSP430Ware™ software for MSP430™ microcontrollers
- Device Comparison summarizes the available devices
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Source Content uid | MSP430FR5962IRGZR | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | Package Description | HVQCCN, |
Reach Compliance Code | compliant | ECCN Code | 5A992.C |
HTS Code | 8542.31.00.01 | Date Of Intro | 2017-01-13 |
Samacsys Manufacturer | Texas Instruments | Has ADC | YES |
Address Bus Width | Bit Size | 16 | |
CPU Family | MSP430 | Clock Frequency-Max | 24 MHz |
DAC Channels | NO | DMA Channels | YES |
External Data Bus Width | JESD-30 Code | S-PQCC-N48 | |
JESD-609 Code | e4 | Length | 7 mm |
Moisture Sensitivity Level | 3 | Number of I/O Lines | 40 |
Number of Terminals | 48 | On Chip Program ROM Width | 8 |
Operating Temperature-Max | 85 °C | Operating Temperature-Min | -40 °C |
PWM Channels | YES | Package Body Material | PLASTIC/EPOXY |
Package Code | HVQCCN | Package Shape | SQUARE |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Peak Reflow Temperature (Cel) | 260 |
RAM (bytes) | 8192 | ROM (words) | 131072 |
ROM Programmability | FRAM | Seated Height-Max | 1 mm |
Speed | 16 MHz | Supply Voltage-Max | 3.6 V |
Supply Voltage-Min | 1.8 V | Supply Voltage-Nom | 3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal Form | NO LEAD | Terminal Pitch | 0.5 mm |
Terminal Position | QUAD | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 7 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
Step1 :Product
-
Step2 :Vacuum packaging
-
Step3 :Anti-static bag
-
Step4 :Individual packaging
-
Step5 :Packaging boxes
-
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We provide high quality products, thoughtful service and after sale guarantee
-
We have rich products, can meet your various needs.
-
Minimum order quantity starts from 1pcs.
-
Lowest international shipping fee starts from $0.00
-
365 days quality guarantee for all products