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NXP MC9S08GT60ACFDE

S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 48-QFN-EP (7x7)

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: MC9S08GT60ACFDE

Datasheet: MC9S08GT60ACFDE Datasheet (PDF)

Package/Case: QFN-48

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 3222 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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MC9S08GT60ACFDE General Description

8BIT MCU, 60K FLASH, 4K RAM, SMD; Controller Family/Series:HCS08; Core Size:8bit; No. of I/O's:39; Program Memory Size:60 KB; RAM Memory Size:4KB; CPU Speed:40MHz; Oscillator Type:External, Internal; No. of Timers:2; Peripherals:ADC, PWM, Timer; Embedded Interface Type:I2C, SCI, SPI; No. of PWM Channels:8; Digital IC Case Style:QFN; Supply Voltage Range:1.8V to 3.6V; Operating Temperature Range:-40°C to +125°C; No. of Pins:48; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Clock Frequency:40MHz; Flash Memory Size:60KB; IC Generic Number:9S08GT60; Interface:I2C, SCI, SPI; Interface:I2C, SCI, SPI; Interface Type:I2C, SCI, SPI; Logic Function Number:60ACFDE; Memory Size:60 K; Memory Type:FLASH; No. of ADC Inputs:8; No. of Bits:8; No. of I/O's:39; Number of bits In Timer:16; Number of bits in ADC:10; Operating Temperature Max:125°C; Operating Temperature Min:-40°C; Package / Case:QFN; Program Memory Size:60KB; Qualified Segment:COMMERCIAL, INDUSTRIAL; RAM Size:4KB; Serial Comms:IIC, SCI(2),SPI

mc9s08gt60acfde

Features

  • CPU: 8-bit HCS08 core
  • Operating frequency: up to 40 MHz
  • Flash memory: 60 KB
  • RAM: 4 KB
  • Timers: 2x 16-bit, 1x 8-bit
  • Analog-to-digital converter (ADC): 16 channels, 10-bit resolution
  • Communication interfaces: UART, SPI, I2C
  • Input/output ports: 55 general-purpose I/O pins
  • Operating voltage range: 2.7 V to 5.5 V

Application

  • MC9S08GT60ACFDE (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)
  • MC9S08GT60ACFDER (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)
  • MC9S08GT60ACFDEE (NXP Semiconductors)

Specifications

Parameter Value Parameter Value
Case/Package QFN Contact Plating Gold
Mount Surface Mount Number of Pins 48
Core Architecture HCS08 Data Bus Width 8 b
Frequency 40 MHz Interface I2C, SCI, SPI
Max Frequency 40 MHz Max Operating Temperature 85 °C
Max Supply Voltage 3.6 V Memory Size 60 kB
Memory Type FLASH Min Operating Temperature -40 °C
Min Supply Voltage 1.8 V Number of ADC Channels 8
Number of Bits 8 Number of I2C Channels 1
Number of I/Os 39 Number of Programmable I/O 39
Number of PWM Channels 2 Number of SPI Channels 1
Number of Timers/Counters 2 Number of UART Channels 2
Operating Supply Voltage 3.3 V Oscillator Type Internal
Peripherals I2C, LVD, POR, PWM, WDT RAM Size 4 kB
Watchdog Timer Yes Height 1 mm
Length 7 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The MC9S08GT60ACFDE chip is a microcontroller unit (MCU) designed by NXP Semiconductors. It belongs to the MC9S08 family and offers a high-performance 8-bit architecture for embedded systems. With a wide range of features and peripherals, this chip is suited for various applications such as consumer electronics, automotive, and industrial control systems.
  • Equivalent

    Some equivalent products of the MC9S08GT60ACFDE chip include MC9S08AC60CFDE, MC9S08GT60ACFDE/Z, and MC9S08GT32ACFDE. These microcontrollers from NXP Semiconductors offer similar features and functionality to the MC9S08GT60ACFDE chip.
  • Features

    The MC9S08GT60ACFDE is a microcontroller from the S08 family. Its features include a 8-bit CPU, a frequency of up to 20 MHz, 60 KB of flash memory, 2 KB of RAM, and several communication interfaces such as UART, SPI, and I2C. It also has a variety of timers and a peripheral module to interface with external devices.
  • Pinout

    The MC9S08GT60ACFDE is a microcontroller with a pin count of 44 pins. It is used for various functions such as control, processing, and communication in embedded systems.
  • Manufacturer

    MC9S08GT60ACFDE is manufactured by NXP Semiconductors, a multinational semiconductor manufacturing company. NXP Semiconductors specializes in the design and production of a wide range of semiconductor solutions for various industries, including automotive, IoT, communication, and industrial applications.
  • Application Field

    The MC9S08GT60ACFDE microcontroller is commonly used in a wide range of applications, including consumer electronics, industrial automation, automotive systems, and medical devices. It is often preferred for its low power consumption, affordability, and versatility in controlling various functions and interfaces.
  • Package

    The MC9S08GT60ACFDE chip has a 44-LQFP package type, a surface mount form, and a size of 10mm x 10mm.

Datasheet PDF

Preliminary Specification MC9S08GT60ACFDE PDF Download

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