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NXP LPC2364FBD100

ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: LPC2364FBD100

Datasheet: LPC2364FBD100 Datasheet (PDF)

Package/Case: LQFP-100

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 2166 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for LPC2364FBD100 or email to us: Email: [email protected], we will contact you within 12 hours.

LPC2364FBD100 General Description

LPC2364FBD100 is a microcontroller from NXP Semiconductors, specifically from the LPC2000 series. Here are some of its features:

lpc2364fbd100

Features

  • It is based on a 16/32-bit ARM7TDMI-S CPU core running at up to 72 MHz.
  • It has 512 KB of flash memory and 64 KB of RAM.
  • It has a variety of peripherals, including multiple UARTs, SPI, I2C, CAN, and USB interfaces.
  • It also has a variety of timers, ADCs, and PWM outputs.

Specifications

Parameter Value Parameter Value
Source Content uid LPC2364FBD100 Pbfree Code Yes
Rohs Code Yes Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS Part Package Code QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100 Pin Count 100
Reach Compliance Code compliant ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 Has ADC YES
Address Bus Width Bit Size 32
CPU Family ARM7 Clock Frequency-Max 25 MHz
DAC Channels YES DMA Channels YES
External Data Bus Width 16 JESD-30 Code S-PQFP-G100
JESD-609 Code e3 Length 14 mm
Moisture Sensitivity Level 3 Number of I/O Lines 70
Number of Terminals 100 Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C PWM Channels YES
Package Body Material PLASTIC/EPOXY Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20 Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified RAM (bytes) 34816
ROM (words) 131072 ROM Programmability FLASH
Seated Height-Max 1.6 mm Speed 72 MHz
Supply Current-Max 100 mA Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V Supply Voltage-Nom 3.3 V
Surface Mount YES Technology CMOS
Temperature Grade INDUSTRIAL Terminal Finish TIN
Terminal Form GULL WING Terminal Pitch 0.5 mm
Terminal Position QUAD Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LPC2364FBD100 chip is a microcontroller designed by NXP Semiconductors. It is based on the ARM7TDMI-S core and operates at a maximum speed of 100 MHz. This chip offers 256 KB of flash memory and 98 KB of RAM, making it suitable for various embedded applications. It also provides various communication interfaces and peripheral functions, making it versatile for different system designs.
  • Equivalent

    Some equivalent products of LPC2364FBD100 chip are LPC2364FBD100/01, LPC2364FBD100/02, and LPC2364FBD100/03.
  • Features

    The LPC2364FBD100 is a 16/32-bit microcontroller from NXP. Its features include a 72 MHz ARM7TDMI-S CPU, 512 KB flash memory, 98 KB RAM, 70 GPIO pins, 10-bit ADC, 10-bit DAC, UART, SPI, I2C, PWM, and USB 2.0. It also includes an integrated Ethernet MAC and CAN interface, making it suitable for a variety of applications.
  • Pinout

    The LPC2364FBD100 is a microcontroller with 100 pins. It provides multiple functions including general-purpose digital I/O, timers/counters, UART, SPI, I2C, CAN, and ADC interfaces. This device is part of the LPC2300 series from NXP Semiconductor, which is designed for embedded applications requiring high performance and extensive peripheral integration.
  • Manufacturer

    The LPC2364FBD100 is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company that specializes in the design and manufacturing of a wide range of integrated circuits and systems for various industries, including automotive, industrial, and consumer electronics.
  • Application Field

    The LPC2364FBD100 microcontroller has various application areas including industrial automation, motor control, consumer electronics, and office automation. It can be used in applications that require communication protocols like USB, CAN, and Ethernet, as well as in devices that require analog-to-digital conversion and digital signal processing capabilities.
  • Package

    The LPC2364FBD100 chip is available in a LQFP package type, with a standard form and a size of 14x14mm.

Datasheet PDF

Preliminary Specification LPC2364FBD100 PDF Download

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