NXP LPC2364FBD100
ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC
Brands: NXP Semiconductor
Mfr.Part #: LPC2364FBD100
Datasheet: LPC2364FBD100 Datasheet (PDF)
Package/Case: LQFP-100
Product Type: Embedded Processors & Controllers
RoHS Status:
Stock Condition: 2166 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomLPC2364FBD100 General Description
LPC2364FBD100 is a microcontroller from NXP Semiconductors, specifically from the LPC2000 series. Here are some of its features:
Features
- It is based on a 16/32-bit ARM7TDMI-S CPU core running at up to 72 MHz.
- It has 512 KB of flash memory and 64 KB of RAM.
- It has a variety of peripherals, including multiple UARTs, SPI, I2C, CAN, and USB interfaces.
- It also has a variety of timers, ADCs, and PWM outputs.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Source Content uid | LPC2364FBD100 | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | NXP SEMICONDUCTORS | Part Package Code | QFP |
Package Description | 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100 | Pin Count | 100 |
Reach Compliance Code | compliant | ECCN Code | 3A991.A.2 |
HTS Code | 8542.31.00.01 | Has ADC | YES |
Address Bus Width | Bit Size | 32 | |
CPU Family | ARM7 | Clock Frequency-Max | 25 MHz |
DAC Channels | YES | DMA Channels | YES |
External Data Bus Width | 16 | JESD-30 Code | S-PQFP-G100 |
JESD-609 Code | e3 | Length | 14 mm |
Moisture Sensitivity Level | 3 | Number of I/O Lines | 70 |
Number of Terminals | 100 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY | Package Code | LFQFP |
Package Equivalence Code | QFP100,.63SQ,20 | Package Shape | SQUARE |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Qualification Status | Not Qualified | RAM (bytes) | 34816 |
ROM (words) | 131072 | ROM Programmability | FLASH |
Seated Height-Max | 1.6 mm | Speed | 72 MHz |
Supply Current-Max | 100 mA | Supply Voltage-Max | 3.6 V |
Supply Voltage-Min | 3 V | Supply Voltage-Nom | 3.3 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN |
Terminal Form | GULL WING | Terminal Pitch | 0.5 mm |
Terminal Position | QUAD | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 14 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The LPC2364FBD100 chip is a microcontroller designed by NXP Semiconductors. It is based on the ARM7TDMI-S core and operates at a maximum speed of 100 MHz. This chip offers 256 KB of flash memory and 98 KB of RAM, making it suitable for various embedded applications. It also provides various communication interfaces and peripheral functions, making it versatile for different system designs.
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Equivalent
Some equivalent products of LPC2364FBD100 chip are LPC2364FBD100/01, LPC2364FBD100/02, and LPC2364FBD100/03. -
Features
The LPC2364FBD100 is a 16/32-bit microcontroller from NXP. Its features include a 72 MHz ARM7TDMI-S CPU, 512 KB flash memory, 98 KB RAM, 70 GPIO pins, 10-bit ADC, 10-bit DAC, UART, SPI, I2C, PWM, and USB 2.0. It also includes an integrated Ethernet MAC and CAN interface, making it suitable for a variety of applications. -
Pinout
The LPC2364FBD100 is a microcontroller with 100 pins. It provides multiple functions including general-purpose digital I/O, timers/counters, UART, SPI, I2C, CAN, and ADC interfaces. This device is part of the LPC2300 series from NXP Semiconductor, which is designed for embedded applications requiring high performance and extensive peripheral integration. -
Manufacturer
The LPC2364FBD100 is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company that specializes in the design and manufacturing of a wide range of integrated circuits and systems for various industries, including automotive, industrial, and consumer electronics. -
Application Field
The LPC2364FBD100 microcontroller has various application areas including industrial automation, motor control, consumer electronics, and office automation. It can be used in applications that require communication protocols like USB, CAN, and Ethernet, as well as in devices that require analog-to-digital conversion and digital signal processing capabilities. -
Package
The LPC2364FBD100 chip is available in a LQFP package type, with a standard form and a size of 14x14mm.
Datasheet PDF
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