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NXP LPC2210FBD144

16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface

ISO14001 ISO9001 DUNS

Brands: NXP Semiconductor

Mfr.Part #: LPC2210FBD144

Datasheet: LPC2210FBD144 Datasheet (PDF)

Package/Case: TQFP144

Product Type: Interface ICs

RoHS Status:

Stock Condition: 3157 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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LPC2210FBD144 General Description

LPC2210FBD144 is a microcontroller chip from NXP Semiconductors, which is now part of Qualcomm. It is a member of the LPC2000 family of ARM-based microcontrollers, which are designed for embedded applications requiring high performance and low power consumption.

lpc2210fbd144

Features

  • ARM7TDMI-S processor core running at up to 60 MHz
  • 128 KB of flash memory and 32 KB of SRAM
  • Ethernet MAC, USB 2.0 full-speed interface, and CAN 2.0B
  • Multiple serial interfaces, including two UARTs, two SPI, and two I2C
  • Multiple timers, including four 32-bit timers with capture/compare channels
  • 10-bit ADC with eight channels
  • On-chip oscillator with PLL and on-chip voltage regulator

Application

  • AT91SAM7X256 from Microchip
  • STM32F103 from STMicroelectronics
  • MSP432P401R from Texas Instruments
  • SAM3X8E from Atmel

Specifications

Parameter Value Parameter Value
Source Content uid LPC2210FBD144 Pbfree Code Yes
Rohs Code Yes Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS Part Package Code QFP
Package Description LFQFP, QFP144,.87SQ,20 Pin Count 144
Reach Compliance Code ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 Has ADC YES
Additional Feature ALSO REQUIRES 3.3 V SUPPLY Address Bus Width 24
Bit Size 32 CPU Family ARM7
Clock Frequency-Max 50 MHz DAC Channels NO
DMA Channels NO External Data Bus Width 32
JESD-30 Code S-PQFP-G144 JESD-609 Code e3
Length 20 mm Moisture Sensitivity Level 2
Number of I/O Lines 76 Number of Terminals 144
Operating Temperature-Max 85 °C Operating Temperature-Min -40 °C
PWM Channels YES Package Body Material PLASTIC/EPOXY
Package Code LFQFP Package Equivalence Code QFP144,.87SQ,20
Package Shape SQUARE Package Style FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified RAM (bytes) 16384
Seated Height-Max 1.6 mm Speed 60 MHz
Supply Voltage-Max 1.95 V Supply Voltage-Min 1.65 V
Supply Voltage-Nom 1.8 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN Terminal Form GULL WING
Terminal Pitch 0.5 mm Terminal Position QUAD
Width 20 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The LPC2210FBD144 is a 16/32-bit ARM microcontroller with a 32KB on-chip SRAM and 128KB on-chip Flash memory. It also features multiple serial interfaces, general-purpose I/O pins, and timers for various applications. The chip is widely used in embedded systems, robotics, and industrial control applications due to its high performance and low power consumption.
  • Equivalent

    The equivalent products of LPC2210FBD144 chip are LPC2212FBD144, LPC2214FBD64, and LPC2214FBD100. These chips are part of the LPC2200 series from NXP Semiconductors and offer similar features and capabilities to the LPC2210FBD144.
  • Features

    The LPC2210FBD144 is a microcontroller from NXP Semiconductors with features such as a 16/32-bit ARM7TDMI-S CPU, 128 KB flash memory, 64 KB RAM, 2 UARTs, 2 SPI, 2 I2C, 8-channel 10-bit ADC, and 6 PWM channels. It also has on-chip debugging and programming functions.
  • Pinout

    The LPC2210FBD144 is a microcontroller from NXP with a 144-pin package. It features an ARM7TDMI-S core, 128 KB of flash memory, and 64 KB of SRAM. The pin functions include GPIO, UART, SPI, I2C, ADC, and JTAG debug interface.
  • Manufacturer

    The LPC2210FBD144 is manufactured by NXP Semiconductors, a Dutch semiconductor manufacturer. NXP Semiconductors specializes in the production of a wide range of semiconductor products for various industries, including automotive, consumer electronics, and industrial applications.
  • Application Field

    The LPC2210FBD144 is commonly used in industrial automation, robotics, motor control, and networking applications. It offers high performance, flexibility, and reliability for various embedded system designs that require real-time processing, communication interfaces, and control capabilities.
  • Package

    The LPC2210FBD144 chip comes in a Ball Grid Array (BGA) package, with a form factor of 144-ball and a size of 13mm x 13mm.

Datasheet PDF

Preliminary Specification LPC2210FBD144 PDF Download

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