NXP LPC2134FBD64/01
MCU 16-bit/32-bit ARM7TDMI-S RISC 128KB Flash 3.3V 64-Pin LQFP
Brands: NXP Semiconductor
Mfr.Part #: LPC2134FBD64/01
Datasheet: LPC2134FBD64/01 Datasheet (PDF)
Package/Case: LQFP-64
Product Type: Power Supplies
RoHS Status:
Stock Condition: 3773 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64, Microcontroller
Specifications
Parameter | Value | Parameter | Value |
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Source Content uid | LPC2134FBD64/01 | Pbfree Code | Yes |
Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | NXP SEMICONDUCTORS | Part Package Code | QFP |
Package Description | 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64 | Pin Count | 64 |
Reach Compliance Code | compliant | ECCN Code | 3A991.A.2 |
HTS Code | 8542.31.00.01 | Has ADC | YES |
Address Bus Width | 8 | Bit Size | 32 |
CPU Family | ARM7 | Clock Frequency-Max | 60 MHz |
DAC Channels | YES | DMA Channels | NO |
External Data Bus Width | 8 | JESD-30 Code | S-PQFP-G64 |
JESD-609 Code | e3 | Length | 10 mm |
Moisture Sensitivity Level | 1 | Number of I/O Lines | 47 |
Number of Terminals | 64 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | -40 °C | PWM Channels | YES |
Package Body Material | PLASTIC/EPOXY | Package Code | LFQFP |
Package Equivalence Code | QFP64,.47SQ,20 | Package Shape | SQUARE |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
Qualification Status | Not Qualified | RAM (bytes) | 16384 |
ROM (words) | 131072 | ROM Programmability | FLASH |
Seated Height-Max | 1.6 mm | Speed | 60 MHz |
Supply Voltage-Max | 3.6 V | Supply Voltage-Min | 3 V |
Supply Voltage-Nom | 3.3 V | Surface Mount | YES |
Technology | CMOS | Temperature Grade | INDUSTRIAL |
Terminal Finish | TIN | Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm | Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | 30 | Width | 10 mm |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | Product Category | ARM Microcontrollers - MCU |
Series | LPC2000 | Mounting Style | SMD/SMT |
Package / Case | LQFP-64 | Core | ARM7TDMI-S |
Program Memory Size | 128 kB | Data Bus Width | 32 bit/16 bit |
ADC Resolution | 10 bit | Maximum Clock Frequency | 60 MHz |
Number of I/Os | 47 I/O | Data RAM Size | 16 kB |
Supply Voltage - Min | 3 V | Supply Voltage - Max | 3.6 V |
Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 85 C |
Brand | NXP Semiconductors | DAC Resolution | 10 bit |
Height | 1.4 mm | Interface Type | I2C, SPI, SSP, UART |
Number of ADC Channels | 8 Channel | Number of Timers/Counters | 2 Timer |
Product Type | ARM Microcontrollers - MCU | Program Memory Type | Flash |
Subcategory | Microcontrollers - MCU |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The LPC2134FBD64/01 is a 16-bit/32-bit ARM microcontroller from NXP Semiconductors. It features a high-performance ARM7TDMI-S core running at up to 60MHz, 512KB of flash memory, 32KB of RAM, and a range of peripherals including UART, SPI, I2C, and ADC. It is commonly used in embedded systems, industrial automation, and communication applications.
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Equivalent
The LPC2134FBD64/01 chip can be replaced by LPC2132FBD64/01 or LPC2137FBD64/01. These chips are all from the same LPC2100 series of microcontrollers by NXP Semiconductors, with similar features and capabilities. -
Features
The LPC2134FBD64/01 is a 16/32-bit ARM7TDMI-S microcontroller with 128 kB flash memory, 16 kB SRAM, 10-bit ADC, UART, SPI, I2C, PWM, and USB interfaces. It operates at a maximum frequency of 60 MHz, has an embedded bootloader for in-system programming, and supports up to 3 external memory banks. -
Pinout
The LPC2134FBD64/01 is a 64-pin microcontroller with 128 KB of flash memory. It features multiple digital and analog I/O pins, UART, SPI, I2C, ADC, PWM, and timers for communication and control applications. -
Manufacturer
NXP Semiconductors is the manufacturer of the LPC2134FBD64/01. It is a global semiconductor company that focuses on designing and manufacturing a wide range of products for various industries, including automotive, industrial, consumer, and computing. NXP's products are used in a variety of applications such as mobile devices, smart appliances, and automotive systems. -
Application Field
The LPC2134FBD64/01 is commonly used in embedded systems, industrial automation, robotics, consumer electronics, and communication applications. It is suitable for a wide range of applications such as motor control, data communication, sensor interfacing, control systems, and more due to its high-performance ARM7TDMI-S core and versatile peripheral features. -
Package
The LPC2134FBD64/01 chip is available in a 64-pin LQFP package with a form factor of Dual In-Line Package (DIP). The dimensions of the package are 10mm x 10mm x 1.4mm.
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