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NXP LPC1114FHN33/302

ARM Microcontrollers - MCU 32b 32K Flash 42I/O

Ovaga Certification

Brands: NXP Semiconductor

Mfr.Part #: LPC1114FHN33/302

Datasheet: LPC1114FHN33/302 Datasheet (PDF)

Package/Case: QFN-32

Product Type: Embedded Processors & Controllers

RoHS Status:

Stock Condition: 3553 pcs, New Original

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Quick Quote

Please submit RFQ for LPC1114FHN33/302 or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of LPC1114FHN33/302 Embedded Processors & Controllers from NXP Semiconductor and we guarantee that they are original, brand new parts sourced directly from NXP Semiconductor We can provide quality testing reports for LPC1114FHN33/302 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.


Parameter Value Parameter Value
Source Content uid LPC1114FHN33/302 Rohs Code Yes
Part Life Cycle Code Active Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN Package Description 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33
Pin Count 33 Reach Compliance Code compliant
ECCN Code EAR99 HTS Code 8542.31.00.01
Has ADC YES Address Bus Width
Bit Size 32 CPU Family CORTEX-M0
Clock Frequency-Max 25 MHz DAC Channels NO
DMA Channels NO External Data Bus Width
JESD-30 Code S-PQCC-N33 JESD-609 Code e4
Length 7 mm Moisture Sensitivity Level 3
Number of I/O Lines 28 Number of Terminals 33
On Chip Program ROM Width 8 Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C PWM Channels NO
Package Body Material PLASTIC/EPOXY Package Code HVQCCN
Peak Reflow Temperature (Cel) 260 RAM (bytes) 8192
ROM (words) 32768 ROM Programmability FLASH
Seated Height-Max 1 mm Speed 50 MHz
Supply Voltage-Max 3.6 V Supply Voltage-Min 1.8 V
Supply Voltage-Nom 3.3 V Surface Mount YES
Technology CMOS Temperature Grade INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Terminal Form NO LEAD
Terminal Pitch 0.65 mm Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30 Width 7 mm


Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US$0.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.


1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


  • Product

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  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Key points

  • The LPC1114FHN33/302 chip is a microcontroller based on the ARM Cortex-M0 processor core. It offers various peripherals and a low power consumption profile. It is widely used in embedded systems, IoT devices, and other applications that require a compact and efficient microcontroller solution.
  • Equivalent

    Some equivalent products to the LPC1114FHN33/302 chip are the LPC1114FBD48/302, LPC1114FBD48/303, and LPC1114FBD48/301 chips.
  • Features

    The LPC1114FHN33/302 is a microcontroller with an ARM Cortex-M0 core, 32KB flash memory, 4KB RAM, and a range of communication interfaces including I2C, UART, and SPI. It also includes a 12-bit ADC, timers, and GPIO pins for versatile functionality.
  • Pinout

    The LPC1114FHN33/302 is a microcontroller with a 33-pin count. Its primary function is to control and manage tasks in various electronic devices.
  • Manufacturer

    The manufacturer of the LPC1114FHN33/302 is NXP Semiconductors. NXP Semiconductors is a global semiconductor company that designs and manufactures a wide range of products, including microcontrollers, memory, and connectivity solutions. They serve various industries, including automotive, industrial, consumer, and communication sectors, providing innovative solutions for a connected world.
  • Application Field

    The LPC1114FHN33/302 is commonly used in various applications such as industrial automation, consumer electronics, robotics, and Internet of Things (IoT) devices. It can be utilized in projects requiring low-power consumption, real-time control, and communication through its integrated peripherals like UART, SPI, I2C, and GPIOs.
  • Package

    The LPC1114FHN33/302 chip has a package type of HVQFN, a form factor of SOT626, and a size of 5x5mm.

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