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ADI JM38510/13501BGA
General Purpose Amplifier 1 Circuit TO-99-8
Brands: Analog Devices, Inc
Mfr.Part #: JM38510/13501BGA
Datasheet: JM38510/13501BGA Datasheet (PDF)
Package/Case: TO-99
RoHS Status:
Stock Condition: 2317 pcs, New Original
Product Type: Amplifier ICs
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $99.736 | $99.736 |
In Stock:2317 PCS
JM38510/13501BGA General Description
The wide input voltage range of ±13 V minimum combined with a high CMRR and high input impedance provide high accuracy in the noninverting circuit configuration. Excellent linearity and gain accuracy can be maintained even at high closed-loop gains. Stability of offsets and gain with time or variations in temperature is excellent. The accuracy and stability of the OP07, even at high gain, combined with the freedom from external nulling have made the OP07 an industry standard for instrumentation applications.
Features
- Low VOS: 75 µV Max
- Low VOS Drift: 1.3 µV/°C Max
- Ultrastable vs. Time: 1.5 µV/Month Max
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-type | Ultra Low Offset Voltage Amplifier | feature-manufacturer-type | Ultra Low Offset Voltage Amplifier |
| feature-number-of-channels-per-chip | 1 | feature-rail-to-rail | |
| feature-process-technology | feature-output-type | ||
| feature-maximum-input-offset-voltage-mv | 0.025@±15V | feature-maximum-supply-current-ma | 4@±15V |
| feature-maximum-input-offset-current-ua | 0.002@±15V | feature-maximum-input-bias-current-ua | 0.002@±15V |
| feature-maximum-power-dissipation-mw | 167 | feature-typical-slew-rate-v-us | 0.08(Min)@±15V |
| feature-typical-gain-bandwidth-product-mhz | feature-shut-down-support | No | |
| feature-packaging | Tube | feature-rad-hard | |
| feature-pin-count | 8 | feature-supplier-package | TO-99 |
| feature-standard-package-name1 | TO | feature-cecc-qualified | No |
| feature-esd-protection | feature-escc-qualified | ||
| feature-military | feature-aec-qualified | No | |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | EAR99 |
| feature-svhc | Yes |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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JM38510/13501BGA chip is an electronic component used in various applications. It has advanced packaging technology, Ball Grid Array (BGA), which enables higher pin density and better electrical performance. This chip is used in industries such as aerospace, defense, and telecommunications for its reliability and performance. Its compact size and high pin count make it suitable for applications with limited space.
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Equivalent
There are no specified equivalent products of the JM38510/13501BGA chip. -
Pinout
The JM38510/13501BGA is an integrated circuit with a Ball Grid Array (BGA) package. The pin count and function of a BGA package depend on the specific IC design and could vary. To determine the pin count and function of a particular BGA component, it is necessary to refer to the datasheet or specific documentation provided by the manufacturer or supplier. -
Application Field
The JM38510/13501BGA is a microcircuit used in a multitude of applications, including military, aerospace, and industrial sectors. It is commonly used in data acquisition systems, telecommunications equipment, avionics systems, and power management devices. Its high-reliability and rugged design make it suitable for harsh environments and critical operations. -
Package
The JM38510/13501BGA chip comes in a BGA (Ball Grid Array) package type. The form and size of the chip may vary depending on the specific model or variant within the JM38510/13501 series.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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