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BROADCOM BCM5389KFBG

Ethernet Switch SPI Interface 256-BGA (17x17)

ISO14001 ISO9001 DUNS

Brands: BROADCOM

Mfr.Part #: BCM5389KFBG

Datasheet: BCM5389KFBG Datasheet (PDF)

Package/Case: FBGA256

Product Type: Ethernet ICs

RoHS Status:

Stock Condition: 5512 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BCM5389KFBG or email to us: Email: [email protected], we will contact you within 12 hours.

BCM5389KFBG General Description

Ethernet Switch SPI Interface 256-BGA (17x17)

Features

  • Eighth-generation switch on a chip
  • Integrates
  • One GMII/RGMII/RvMII interface
  • Nine MACs (802.x compliant) with support for 9-KB jumbo frames
  • Eight SGMII/SerDes interfaces and 128-KB packet buffer memory
  • Non-blocking 9-Gigabit Ethernet fully integrated switch fabric
  • SPI Interface for easy setup and managed operation
  • Classifies packets using four 802.1p QoS or DiffServ priority queues
  • VLAN 4k 802.1Q or port-based support
  • Supports up to 4k unicast MAC addresses
  • Supports MAC-based port aggregation (trunking)
  • Flow control
  • Full-duplex (802.3x) and half-duplex options support
  • Supports automatic address learning and aging
  • Support for Spanning Tree and Rapid Spanning Tree
  • Low power 0.13 µm 1.2 V CMOS core: <1.5W Pd.
  • Fanless operation support
  • Port-based rate control feature with 64kbps granularity
  • 256-pin FBGA package (small form factor 17 mm x 17 mm)
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Specifications

Parameter Value Parameter Value
Mfr Broadcom Limited Series -
Package Tray Product Status Obsolete
Programmabe Not Verified Protocol Ethernet
Function Switch Interface SPI
Standards - Voltage - Supply 1.2V ~ 1.26V
Current - Supply - Operating Temperature -
Package / Case - Supplier Device Package 256-BGA (17x17)
Base Product Number BCM5389 Rohs Code Yes
Part Life Cycle Code Obsolete Ihs Manufacturer BROADCOM INC
Package Description 17 X 17 MM, FBGA-256 Reach Compliance Code compliant
HTS Code 8542.39.00.01 Samacsys Manufacturer Avago Technologies
JESD-30 Code S-PBGA-B256 JESD-609 Code e1
Moisture Sensitivity Level 3 Number of Functions 1
Number of Terminals 256 Package Body Material PLASTIC/EPOXY
Package Code BGA Package Shape SQUARE
Package Style GRID ARRAY Peak Reflow Temperature (Cel) 260
Supply Voltage-Nom 1.2 V Surface Mount YES
Technology CMOS Telecom IC Type TELECOM CIRCUIT
Terminal Finish TIN SILVER COPPER Terminal Form BALL
Terminal Position BOTTOM

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BCM5389KFBG chip is a high-performance, integrated Ethernet switch designed for use in networking equipment. It offers eight 10/100/1000 Mbps Ethernet ports with advanced features like quality of service (QoS) and virtual LAN (VLAN) support. This chip provides reliable and efficient data transfer, making it suitable for various applications that require high-speed networking capabilities.
  • Equivalent

    Some equivalent products of the BCM5389KFBG chip include the BCM53114KQLEG, BCM5386KFBG, and BCM5388KFBG.
  • Features

    The BCM5389KFBG is a high-performance, integrated, 9-port Ethernet switch with features like Gigabit Ethernet ports, advanced managed switch capabilities, VLAN support, QoS prioritization, and integrated traffic management. It also includes power-saving features and can be used in various applications, including enterprise networks, data centers, and service provider networks.
  • Pinout

    The BCM5389KFBG is a 128-pin integrated circuit used as a gigabit Ethernet switch. It functions as a high-performance Ethernet port switch with advanced features such as VLAN (Virtual Local Area Network) support, QoS (Quality of Service), and traffic management. It also supports multiple interfaces such as copper, fiber optic, or both.
  • Manufacturer

    The manufacturer of the BCM5389KFBG is Broadcom Corporation. Broadcom is a global technology company that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. They specialize in the design of integrated circuits for networking, wireless communication, and connectivity applications in various industries, including telecommunications, data centers, and automotive.
  • Application Field

    The BCM5389KFBG is a Gigabit Ethernet switch primarily used in networking applications such as enterprise data centers, campus networks, and telecommunications equipment. It offers high-speed and reliable connectivity solutions for various devices and enables efficient data transfer and network management.
  • Package

    The BCM5389KFBG chip is packaged in a 256-Pin BGA (Ball Grid Array) form with a size of 17x17 mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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