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ST BALF-SPI2-01D3
RF Balun 868MHz ~ 928MHz 50 / 50Ohm 6-UFBGA, FCBGA
Brands: ST
Mfr.Part #: BALF-SPI2-01D3
Datasheet: BALF-SPI2-01D3 Datasheet (PDF)
Package/Case: UFBGA6
Product Type: Sensors, Transducers
BALF-SPI2-01D3 General Description
This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
Features
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| ECCN US | EAR99 | ECCN EU | NEC |
| Packing Type | Tape And Reel | RoHs compliant | Ecopack2 |
| Grade | Industrial |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the BALF-SPI2-01D3 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part points
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The BALF-SPI2-01D3 chip is an integrated device that supports Bluetooth Low Energy (BLE) connectivity. It features a low power consumption design and offers excellent RF performance. The chip is commonly used in applications that require wireless communication, such as Internet of Things (IoT) devices, wearables, and smart home systems.
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Features
The BALF-SPI2-01D3 is a compact balun module designed for use in devices such as smartphones and tablets. It operates in the frequency range of 800MHz to 2.7GHz, offering excellent performance with low insertion loss and high linearity. Its small size and integrated components make it ideal for space-constrained applications. -
Pinout
The BALF-SPI2-01D3 has 8 pins and is a balanced low pass filter designed for the SPI(Serial Peripheral Interface) in applications such as wireless communication systems. -
Manufacturer
The manufacturer of the BALF-SPI2-01D3 is Murata Manufacturing Co., Ltd. Murata is a global electronic components company based in Japan. They provide a wide range of products, including capacitors, inductors, resistors, sensors, and other electronic components. -
Application Field
The BALF-SPI2-01D3 is a 2.4 GHz Bluetooth low energy and Zigbee combo module. It can be used in various applications such as home automation, lighting control systems, smart meters, asset tracking, and healthcare devices. Its small size and low power consumption make it suitable for embedded systems and IoT applications. -
Package
The BALF-SPI2-01D3 chip has a package type of QFN (Quad Flat No-leads), a form factor of Surface Mount, and a size of 2.0mm x 2.0mm.
Datasheet PDF
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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