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Altera EP4SGX180KF40C2N

FPGA Stratix® IV GX Family 175750 Cells 40nm Technology 0.9V 1517-Pin FC-FBGA Tray

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4SGX180KF40C2N

Datasheet: EP4SGX180KF40C2N Datasheet (PDF)

Package/Case: FBGA-1517

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2200 pcs, New Original

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Please submit RFQ for EP4SGX180KF40C2N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4SGX180KF40C2N General Description

Stratix® IV GX Field Programmable Gate Array (FPGA) IC 744 13954048 175750 1517-BBGA, FCBGA

ep4sgx180kf40c2n

Features

  • It is built on a 40 nm process technology
  • It has 180K logic elements (LEs)
  • It has 4,450 embedded memory blocks (MBits)
  • It has 744 18 x 18 multipliers
ep4sgx180kf40c2n

Application

  • EP4SGX180KF40C2N can be used in a wide range of applications, including high-speed networking, video and image processing, military and aerospace systems, and high-performance computing.
Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Stratix® IV GX feature-process-technology 40nm
feature-maximum-number-of-user-i-os 744 feature-number-of-registers 140600
feature-device-logic-cells 175750 feature-device-system-gates
feature-number-of-multipliers 920 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 13627 feature-total-number-of-block-ram 20+950
feature-ethernet-macs 1 feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V-by-One HS|UART|SD/MMC SPI
feature-supported-ip-core-manufacture Altera/CAST, Inc/Bitec/Eureka Technology Inc/El Camino GmbH feature-maximum-number-of-serdes-channels 88
feature-device-logic-units 175750 feature-device-number-of-dlls-plls 8
feature-transceiver-blocks 24 feature-transceiver-speed-gbps 8.5
feature-dedicated-dsp 115 feature-pci-blocks 2
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 2 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVPECL|LVDS feature-single-ended-i-o-standards-supported LVTTL|CMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|DDR3 SDRAM|RLDRAM II|QDRII+SRAM feature-minimum-operating-supply-voltage-v 0.87
feature-maximum-operating-supply-voltage-v 0.93 feature-packaging Tray
feature-rohs feature-rad-hard
feature-pin-count 1517 feature-supplier-package FC-FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A001.a.7.a
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4SGX180KF40C2N chip is a high-performance Stratix IV FPGA from Intel (formerly Altera). It features a rich set of logic elements, high-speed transceivers, and embedded memory blocks. This chip is designed for demanding applications such as high-speed communication, signal processing, and embedded systems.
  • Equivalent

    The equivalent products of EP4SGX180KF40C2N chip are Xilinx Virtex-6 XC6VSX315T-FF1156 and Altera Stratix IV EP4SGX180KF40C2N-REVB.
  • Features

    The EP4SGX180KF40C2N is a Stratix IV GX FPGA from Intel. It features 178,560 logic elements, 5,792 embedded memory blocks, 672 embedded 18 x 18 multipliers, and 16 transceivers operating at 3.125 Gbps. It also has support for high-speed serial communication interfaces like PCIe and Gigabit Ethernet.
  • Pinout

    The pin count of the EP4SGX180KF40C2N is 1517. It is a FPGA (Field Programmable Gate Array) with a high-speed transceiver that can be used for high-performance computing and networking applications.
  • Manufacturer

    The EP4SGX180KF40C2N is manufactured by Intel Corporation, which is a multinational technology company specializing in semiconductor manufacturing. They are one of the world's largest and highest valued semiconductor chip makers based on revenue. Intel produces a wide range of products, including processors, memory chips, and other integrated circuits used in computers, smartphones, and other electronic devices.
  • Application Field

    The EP4SGX180KF40C2N is commonly used in high-performance applications such as telecommunications, networking, and high-speed computing. It is ideal for applications that require advanced capabilities such as signal processing, data encryption, and high-speed interfaces.
  • Package

    The EP4SGX180KF40C2N chip comes in a Ball Grid Array (BGA) package, with a form factor of 40mm x 40mm and a size of 1517-ball.

Datasheet PDF

Preliminary Specification EP4SGX180KF40C2N PDF Download

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  • quantity

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    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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