This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

THGBMHG Memory ICs Datasheet, Features, Specifications, and Applications

Update Time: Nov 07, 2024      Readership: 244

The THGBMHG series is a family of eMMC (embedded MultiMediaCard) memory ICs developed by Toshiba (now Kioxia). Designed for use in mobile devices, automotive systems, and embedded applications, THGBMHG memory ICs provide reliable, high-capacity storage in a compact form factor. This article provides an overview of the THGBMHG series, highlighting its key features, specifications, and applications.



What is THGBMHG Memory IC?

The THGBMHG memory ICs are eMMC flash memory devices that integrate NAND flash storage with an embedded controller in a single package. These ICs conform to the JEDEC eMMC standard, providing a complete, easy-to-integrate storage solution with managed NAND and advanced error correction. THGBMHG ICs offer a range of capacities, high-speed data access, and robust endurance, making them ideal for applications that require reliable and fast storage, such as smartphones, automotive systems, and industrial equipment.

Architecture of THGBMHG Memory ICs

The THGBMHG series is built on NAND flash technology with an integrated memory controller, which manages error correction, wear leveling, and bad block management. This architecture provides reliable data storage by offloading memory management tasks from the host processor. The eMMC interface allows high-speed data transfer rates and supports multiple command sets, providing efficient, flexible storage management for embedded systems. The THGBMHG series is compatible with eMMC 5.0 standards, ensuring fast read and write speeds, as well as seamless integration with various microcontrollers and processors.

Features of THGBMHG

  • High-Speed Data Transfer: The THGBMHG series supports eMMC 5.0, offering high-speed data transfer rates up to 400 MB/s, ensuring quick data access and fast boot times for systems.

  • Integrated Error Correction and Wear Leveling: The memory ICs feature built-in error correction code (ECC) and wear leveling, enhancing data reliability and extending the lifespan of the flash memory.

  • Compact and Versatile Design: Available in a BGA package, THGBMHG ICs are compact and suitable for integration into space-constrained devices, including mobile phones and automotive systems.

Specifications of THGBMHG

Capacity and Storage Options

  • Available Capacities: The THGBMHG series is available in various capacities, typically ranging from 16 GB to 128 GB, allowing for flexibility in application requirements.
  • NAND Technology: The ICs use 3D NAND flash technology, which offers higher density, improved performance, and better endurance compared to traditional 2D NAND.

Performance Metrics

  • Data Transfer Rate: With eMMC 5.0 support, THGBMHG ICs can achieve read speeds up to 400 MB/s and write speeds up to 150 MB/s, making them suitable for high-speed data access and storage applications.
  • Latency: Low latency architecture provides fast response times, ideal for real-time data processing in automotive and industrial systems.

Power Consumption

  • Low Power Operation: THGBMHG memory ICs are optimized for low power consumption, making them suitable for mobile and battery-powered applications.

  • Power Save Features: The memory ICs support standby and sleep modes, reducing power consumption when data access is not required, thereby extending battery life in portable devices.

Package Types and Physical Dimensions

  • Available Packaging Options: THGBMHG ICs are housed in a BGA (Ball Grid Array) package, providing a compact and durable design for efficient heat dissipation and easy integration into small form factors.
  • Size and Fit: The compact BGA package makes the THGBMHG series ideal for space-constrained designs, including portable and embedded systems, where board space is limited.

Applications of THGBMHG

  • Mobile Devices: The THGBMHG series is commonly used in smartphones and tablets, providing fast storage for operating systems, apps, and multimedia content, and ensuring smooth user experiences with quick boot and access times.

  • Automotive Infotainment Systems: In automotive applications, the THGBMHG ICs are used in infotainment, navigation, and ADAS systems, where high-speed and reliable storage is essential for real-time data processing and media playback.

  • Industrial and IoT Devices: The THGBMHG series is ideal for industrial automation and IoT applications, offering reliable and high-speed data storage for system logs, sensor data, and firmware updates in embedded systems.

  • Consumer Electronics: THGBMHG memory ICs are employed in various consumer electronics, such as digital cameras, smart TVs, and wearables, providing fast and efficient storage for apps, media, and operating systems.

  • Embedded Systems: The THGBMHG series is widely used in embedded systems for applications that demand high-performance storage, such as medical equipment, data acquisition systems, and control modules.

THGBMHG Package

The THGBMHG memory ICs are available in a compact BGA package, designed to provide efficient heat dissipation and ease of integration into PCB layouts. The small footprint of the BGA package is ideal for devices with space limitations, making it suitable for mobile, automotive, and embedded applications where board space and thermal performance are critical.

THGBMHG Manufacturer

The THGBMHG series is manufactured by Kioxia (formerly Toshiba Memory Corporation), a global leader in NAND flash memory technology. Kioxia is known for producing reliable, high-quality memory solutions for a wide range of applications, including consumer electronics, automotive, and industrial systems.

THGBMHG Datasheet

The THGBMHG datasheet provides comprehensive technical details on electrical characteristics, pin configurations, and design integration guidelines. Designers can refer to the datasheet to ensure optimal performance and reliable operation when integrating THGBMHG memory ICs into their systems.

THGBMHG vs. Other eMMC Solutions: A Comparative Analysis

  • THGBMHG vs. Samsung eMMC: Samsung’s eMMC solutions offer similar performance and capacity options. However, the THGBMHG series is optimized for reliability and durability, especially in automotive and industrial applications, where Kioxia’s NAND flash technology provides high endurance.

  • THGBMHG vs. SanDisk iNAND: SanDisk iNAND offers comparable read/write speeds, but the THGBMHG series provides enhanced thermal management and a lower power footprint, making it more suited for embedded systems and battery-powered devices.

  • THGBMHG vs. UFS: While UFS (Universal Flash Storage) offers faster sequential read/write speeds than eMMC, the THGBMHG eMMC ICs remain a cost-effective and reliable solution for applications where eMMC’s performance is sufficient and system cost is a priority.

Conclusion

The THGBMHG Memory ICs provide a compact, high-performance storage solution for a wide range of applications, from mobile devices to automotive infotainment and industrial systems. With fast data transfer rates, low power consumption, and integrated error correction, the THGBMHG series is ideal for applications that require reliable and efficient storage. Whether used in consumer electronics or embedded systems, THGBMHG memory ICs deliver robust performance in a small form factor.

Share:

FAQFAQ

  • What are the key differences between THGBMHG and other eMMC memory ICs?

    The THGBMHG series offers high data transfer speeds (up to 400 MB/s read), low power consumption, and advanced error correction, making it highly reliable for applications in mobile devices, automotive systems, and industrial equipment.

  • Is the THGBMHG series suitable for automotive applications?

    Yes, the THGBMHG series is used in automotive infotainment, navigation, and ADAS systems due to its high reliability, low power consumption, and fast data access capabilities.

  • What is the maximum capacity of the THGBMHG series?

    The THGBMHG series typically supports capacities up to 128 GB, providing flexible storage options for a variety of applications.

Stella Brinkley

Stella Brinkley is a senior electronics engineer with 6 years of experience, specializing in the detailed study of resistor, transistor and package design. Her comprehensive knowledge allows her to drive innovation and excellence in the electronics industry.

Hot Products

  • TC7766WBG

    TC7766WBG

    Toshiba

    Intelligently detect and respond to wireless charg...

  • WLC1115-68LQXQ

    WLC1115-68LQXQ

    Infineon Technologies

    WLC1115-68LQXQ offers wireless charging capabiliti...

  • MWCT1001AVLH

    MWCT1001AVLH

    NXP USA Inc.

    5 Watt Wireless Charging Transmitter ICs for Autom...

  • MWCT1000CFM

    MWCT1000CFM

    NXP USA Inc.

    Revolutionary technology embedding wireless chargi...

  • STWLC33JRF

    STWLC33JRF

    STMicroelectronics

    High-Power Wireless Charging IC

  • TB6865AFG

    TB6865AFG

    Toshiba Semiconductor and Storage

    High-power transmitter IC for wireless charging

  • IAUZ30N06S5L140

    IAUZ30N06S5L140

    Infineon

    Suitable for LED lighting, Wireless charging and A...

  • BCM43455HKUBG

    BCM43455HKUBG

    BROADCOM

    RF System on a Chip - SoC 11ac 1x1 BT4.1 FM wirele...

  • NXQ1TXA5

    NXQ1TXA5

    NXP

    NXP 5 V QI LOW POWER WIRELESS CHARGING TRANSMITTER

  • MWCT1013AVLH

    MWCT1013AVLH

    NXP

    Advanced wireless charging capabilities with up to...

  • P9235A-8NDGI8

    P9235A-8NDGI8

    RENESAS

    Elevate your charging experience with Renesas Elec...

  • NXQ1TXH5/101

    NXQ1TXH5/101

    NXP Semiconductor

    Wireless Charging ICs NXQ1TXH5/HVQFN32//101/REEL 1...

  • EM2130L02QI

    EM2130L02QI

    Intel Corp

    High-efficiency wireless charging solution for you...

Popular Manufacturers